ISSN:
1042-7147
Keywords:
Polymer for microelectronics
;
Heat-resistant polymer
;
Polyimide
;
Photopolymer
;
Photosensitive polyimide
;
Alkaline solution development
;
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
New photosensitive polyimide precursors developable with aqueous alkaline solutions were synthesized. Among diamine monomers having a photofunctional group, 2′-(methacryloyloxy)ethyl 3,5-diaminobenzoate yields high molecular weight polyamic acid. A photosensitive polymer composition consisting of Michler's ketone and a thermally stable peroxide, 3,3′,4,4′-tetrakis(t-butyldioxycarbonyl)benzophenone, results in a high photosensitivity of 200 J/m2. The photosensitive coating of the composition is soluble in aqueous alkaline solutions as well as in organic aprotic polar solvents, and both solvents can be used as developers. However, the resolution of patterns is quite different, especially in thick films. Solvent developers results in poor resolution, whereas aqueous alkaline developers give patterns of high aspect ratio even in thick films. This is probably due to the difference in the diffusion efficiency and swelling properties of the polymer compared to the developers.
Additional Material:
7 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pat.1993.220040407
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