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  • Oxford University Press  (47)
  • American Physical Society  (24)
  • American Institute of Physics (AIP)  (15)
  • 1
    Electronic Resource
    Electronic Resource
    Quasi-steady-state heat transfer/thermal stress model for dislocation generation in the vertical gradient freeze growth of GaAs (1993)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 4016-4022 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have formulated a tractable model of the vertical gradient freeze (VGF) process for GaAs, providing dislocation density contour lines in terms of geometrical and physical parameters. First, the temperature distribution in a cylindrical boule has been determined in closed form involving modified Bessel functions of the first kind, order zero (I0) by solving the quasi-steady-state partial differential equation for heat conduction. Subsequently, the principal thermoelastic stress components have been evaluated and then resolved in the {111}, 〈11¯0(approximately-greater-than) slip system which in excess of the critical resolved shear stress (CRSS) introduce dislocations by slip. We present dislocation density contour maps for 2- and 3-in.-diam undoped (100) GaAs grown by VGF under a variety of linear thermal gradients (v) imposed on the periphery of the boule. We show that for large v the dislocation distribution is similar to that observed in liquid-encapsulated Czochralski (LEC) material but lowering v effectively suppresses dislocation generation even in boules larger than 2 in. in diameter. A comparison of dislocation generation in VGF and standard LEC growth using very recent CRSS data is also given.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.352868
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  • 2
    Electronic Resource
    Electronic Resource
    Silicon-doping level dependent diffusion of Be in AlGaAs/GaAs quantum well lasers (1992)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 4648-4654 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have investigated Be diffusion during molecular beam epitaxial growth of GaAs/AlGaAs graded index separate confinement heterostructure laser structures using secondary ion mass spectrometry (SIMS). For growth at 700 °C we find that Be from the p-type AlGaAs cladding layer diffuses into the quantum well and beyond. As a result, the p-n junction is displaced from the heterojunction. The extent of Be diffusion is found to depend on the dopants in the graded index (GRIN) regions adjoining the GaAs active layer. When the GRIN segments are left intentionally undoped, Be diffuses through the entire p-side GRIN, the quantum well active and a significant portion of the n-side GRIN. However, when the GRIN regions are doped, respectively, with Be and Si on the p and n sides, the displacement of the p-n junction caused by Be diffusion is significantly reduced. Assuming that Be diffuses from a constant source at the surface into a n-type layer as a singly charged interstitial donor, our analysis predicts that increasing the doping of the n layer retards the diffusion of Be while that of the p layer enhances it. Further, including the electric field of the p-n junction in the model leads to peaks and inflections resembling those observed in the experimental SIMS profiles. In view of Be-related oxygen contamination and Be diffusion on the p-side GRIN region, Be should be dispensed with on the p side, however, Si addition on the n side is beneficial as it minimizes Be diffusion and p-n junction displacement.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.352120
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  • 3
    Electronic Resource
    Electronic Resource
    A comparison of reducing the dislocation densities in GaAs grown by the vertical gradient freeze and liquid-encapsulated Czochralski techniques (1993)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 477-479 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have recently applied the quasi-steady state heat transfer/thermal stress model for dislocation generation to the vertical gradient freeze (VGF) process for GaAs, permitting a direct comparison with the original treatment of liquid-encapsulated Czochralski (LEC) growth. Very recent high temperature critical resolved shear stress (CRSS) data on undoped VGF and In-doped LEC specimens were used. We show that the ∼threefold increase in CRSS with In is sufficient to inhibit defect formation in the central ∼75% of 3 in. diameter LEC wafers grown in a high ambient temperature gradient, duplicating the etch-pit density (EPD) data. Undoped VGF wafers are predicted to be nearly dislocation-free. The theoretical results on 3 in. material track the low EPD counts in both the 〈100〉 and 〈110〉 directions in a 5 K/cm gradient imposed on the crystals' surface. We also discuss the origin of dislocations in regions free of thermal stresses and propose their suppression by the addition of a small amount of In in VGF experiments.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.353825
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  • 4
    Electronic Resource
    Electronic Resource
    Inverse scattering on the line for a Dirac system (1991)
    College Park, Md. : American Institute of Physics (AIP)
    Journal of Mathematical Physics 32 (1991), S. 3015-3030 
    Details
    ISSN: 1089-7658
    Source: AIP Digital Archive
    Topics: Mathematics , Physics
    Notes: The whole-line version of the Gelfand–Levitan–Marchenko (GLM) equation for a Dirac system is studied. A new derivation of the GLM equation is given, under weaker hypotheses than Frolov's earlier treatment [Sov. Math. Dokl. 13, 1468 (1972)], and the complete inversion is carried out in some explicit cases in which a spectral gap is present. Previous calculations of this type are restricted either to a scalar potential or degenerate gap. Applications are discussed in connection with optical couplers and soliton equations.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.529046
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  • 5
    Electronic Resource
    Electronic Resource
    Redistribution of Zn in GaAs-AlGaAs heterojunction bipolar transistor structures (1990)
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 56 (1990), S. 1251-1253 
    Details
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The redistribution of Zn in the base region of GaAs-AlGaAs heterojunction bipolar transistor structures during growth by organometallic vapor phase epitaxy has been examined with respect to the presence of Si doping in the emitter-contact, emitter, and collector/subcollector layers, and as a function of Zn doping concentration and Si counterdoping level in the p+ base. For a growth temperature of 675 °C the Zn shows no significant redistribution up to concentrations of 3×1019 cm−3 without Si doping. The addition of Si to the adjacent AlGaAs emitter and collector/subcollector layers causes substantial diffusion of Zn from the base, while Si doping of the GaAs emitter contact results in even greater Zn redistribution. Under these conditions, the Zn concentration in the base attains a maximum value of ∼7×1018 cm−3. Silicon counterdoping in the base region retards the Zn diffusion, while strain introduced by an InGaAs cap layer has no effect on the Zn redistribution.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.102528
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  • 6
    Electronic Resource
    Electronic Resource
    Role of vanadium in organometallic vapor phase epitaxy grown GaAs (1989)
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 54 (1989), S. 1772-1774 
    Details
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The electrical and photoluminescent properties of vanadium incorporated into GaAs epitaxial layers from a VO(OC2H5)3 source during organometallic vapor phase epitaxy were examined. The vanadium concentration in the GaAs was controllably varied from 1016 to 1018 atoms cm−3. Deep level transient spectroscopy showed the presence of an electron trap at Ec−0.15 eV which increased in concentration with vanadium content of the epitaxial layers. A maximum value of 8×1015 cm−3 for this trap was obtained. There were no midgap electron traps associated with vanadium. In intentionally Si-doped epitaxial layers, co-doping with vanadium was observed to have no effect in reducing the carrier density when the Si concentration was ≥4×1016 cm−3. The net carrier concentration profiles resulting from 29Si implantation into GaAs containing 1018 cm−3 of total V had sharper tails than for similar implantation into undoped material, indicating the presence of less than 1016 cm−3 V-related acceptors. Photoluminescent spectra exhibited the characteristic V+3 intracenter emission at 0.65–0.75 eV. No other deep level photoluminescence was detected. For a V concentration of 1016 cm−3 only 2.5×1013 cm−3 was electrically active. Over the entire V concentration investigated this impurity was predominantly (≥99%) inactive.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.101287
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  • 7
    Electronic Resource
    Electronic Resource
    Growth of high quality AlGaAs by metalorganic molecular beam epitaxy using trimethylamine alane (1990)
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 56 (1990), S. 2654-2656 
    Details
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: AlGaAs grown by metalorganic molecular beam epitaxy (MOMBE) has been problematic due to oxygen and carbon contamination, particularly when triethylaluminum (TEAl) has been used as the aluminum source. Consequently, we have investigated trimethylamine alane (TMAAl) as a potential replacement for the conventional metalorganic Al sources. AlGaAs films with excellent structural and optical properties have been grown with this source. Photoluminescence intensities from AlGaAs grown by MOMBE at 500 °C using TMAAl are comparable to those from material grown by metalorganic chemical vapor deposition at 675 °C using triethylaluminum (TMAl). Carbon and oxygen levels in MOMBE-grown AlGaAs are drastically reduced in comparison to similar films grown with TEAl.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.102866
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  • 8
    Electronic Resource
    Electronic Resource
    Mechanisms of interdiffusion in copper/nickel thin-film couples (1986)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 1147-1155 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Mechanisms of interdiffusion in copper/nickel thin-film couples have been investigated in the temperature interval 573–777 K by in situ measurement of contact resistance, Auger depth profiling (ADP), and transmission electron microscopy. Correlation between evolution of contact resistance and measured Auger concentration profiles has been established and mechanisms incorporating rapid grain boundary diffusion, followed by defect-assisted diffusion into grain interiors (Type B kinetics), are proposed to explain the accelerated reactions observed. A modified Whipple model and two independent methods, based on ADP and contact resistance measurements, are used to calculate grain boundary and intragranular diffusion coefficients, respectively. The calculated grain boundary diffusion coefficient is (0.82 cm2/s) exp(−1.48eV/kT) for nickel in copper, and approximately 4×10−13 cm2/s for copper in nickel at 673 K. An average intragranular diffusion coefficient for nickel in copper is determined to be (2.6×10−6 cm2/s) exp(−1.38 eV/kT) by both methods, whereas ADP data yield a corresponding value of (5.2×10−8 cm2/s) exp(−1.51eV/kT) for copper in nickel. It is concluded that characterization of chemical composition and microstructure, combined with in situ measurement of concomitant electrical properties, provides a reliable description of interdiffusion mechanisms in this system.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.336552
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  • 9
    Electronic Resource
    Electronic Resource
    An analysis of dislocation reduction by impurity hardening in the liquid-encapsulated Czochralski growth of 〈111〉 InP (1985)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 58 (1985), S. 4383-4389 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Excessive impurity additions have been widely used to suppress dislocation generation in the liquid-encapsulated Czochralski (LEC) growth of InP. We have analyzed this approach by means of the quasi-steady-state heat transfer/thermal stress model. A strong motivation for the investigation was provided by the recent measurement of the critical resolved shear stress σCRS of InP as a function of temperature in the range 748–948 °K for several Ge and S concentrations. The experimental data were analyzed by the method of least squares via the usually accepted logarithmic dependence of σCRS on reciprocal temperature. The extrapolated values of σCRS exhibit a monotonic increase with impurity addition at temperatures near the melting point. Introducing the σCRS and realistic estimates of other physical properties (thermal diffusivity, thermal expansion coefficient, elastic constants, etc.) in the thermal stress model, the dislocation distribution pattern in a {111} substrate cut from a 〈111〉 boule was constructed. This necessitated a suitable recasting of the formalism that was previously applicable only to the {100} orientation. The computed dislocation contour maps on {111} wafers display sixfold symmetry resembling the "Star of David,'' in overall agreement with etch-pit patterns. InP crystals 2.5 cm in diameter grown in a standard high ambient temperature gradient but containing a large amount of Ge ((approximately-equal-to)1019 cm−3) are predicted and observed to be dislocation-free. On the other hand, in nominally undoped material a large density of defects is forecast, especially at the periphery, in line with the etchpit configuration. Intermediate doping levels (∼1017 cm−3 Ge, ∼1018 cm−3 S) reduce the density in the core but leave the outer edge essentially unaltered.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.335528
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  • 10
    Electronic Resource
    Electronic Resource
    Surface polygonization on GaAs wafers (1988)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 1468-1471 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Polygonized surface structure produced by furnace annealing GaAs wafers was studied by optical and scanning electron microscopy. The surface structure was revealed by chemically etching wafers which had been implanted with silicon and subjected to a furnace annealing cycle. Cathodoluminescence micrographs demonstrate an absence of impurity segregation to the polygon boundaries. No correlation was found between growth-induced dislocations and the polygonal networks. It is proposed that the surface structure results from a vacancy-condensation process. Related surface effects were observed for rapidly annealed wafers. A correlation between the furnace annealed and rapidly annealed GaAs is presented.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.341819
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