ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
A new curing system which yields room temperature curing epoxy adhesives with high bond strength and softening point has been developed for service in contact with high explosives. Bisphenol A type resins cured with hydroxyl alkyl phosphate acid esters are used. Short pot life and relatively low alkali resistance are drawbacks of the system.
Additional Material:
3 Tab.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760010110
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