Publication Date:
1981-01-01
Description:
Presented in this paper is a realization of Multi-Layer Substrate with 30μm signal pattern width and 100μm square via holes on a 100 mm square ceramic substrate. To obtain this fine signal pattern width, a thin film technique, “GSP” process, has been applied on a thick film dielectric layer. For the 100μm square via holes through the thick film dielectric, a new thick film technique, “DD” process, has been developed utilizing a photolithographic technique. This paper describes the processes and the results obtained by the method.
Print ISSN:
0305-3091
Topics:
Electrical Engineering, Measurement and Control Technology
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