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  • FABRICATION TECHNOLOGY  (1)
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  • 1985-1989  (1)
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    Solder Bonding for Power Transistors (1985)
    In:  Other Sources
    Details
    Publication Date: 2019-06-28
    Description: Indium solder boosts power rating and facilitates circuit changes. Efficient heat conduction from power transistor to heat sink provided by layer of indium solder. Low melting point of indium solder (141 degrees C) allows power transistor to be removed, if circuit must be reworked, without disturbing other components mounted with ordinary solder that melts at 181 degrees C. Solder allows devices operated at higher power levels than does conventional attachment by screws.
    Keywords: FABRICATION TECHNOLOGY
    Type: MSC-20570 , NASA Tech Briefs (ISSN 0145-319X); 8; 4; P. 559
    Format: text
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    NASA TECHNICAL REPORTS
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