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  • 1985-1989  (9)
  • 1980-1984  (2)
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  • 11
    Electronic Resource
    Electronic Resource
    Study of the cure kinetics of structural adhesives by ultrasonic interface waves (1985)
    Springer
    Journal of materials science 20 (1985), S. 3300-3304 
    Details
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract An ultrasonic method for in situ study of the curing kinetics of structural adhesives is described. The measurements are performed by ultrasonic interface waves, which produce shear oscillations in the plane of the bond line. The shear resistance of the interface changes in the curing process: softening of the prepreg and its transition to the liquid phase, and the beginning and the termination of the polymerization reaction. Measurements performed at temperatures from 60 to 120° C for the FM-73 adhesive showed that the activation energy of the curing reaction is 38.9 kJ mol−1.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00545198
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