Electronic Resource
Woodbury, NY
:
American Institute of Physics (AIP)
Applied Physics Letters
62 (1993), S. 1435-1437
ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
We report the first use of high temperature superconductors for multilayer interconnection of bare semiconductor die to form multichip modules. Ten die with a total of 160 pads were interconnected on a 3.4 cm2 substrate. The interconnections were a combination of YBa2Cu3O7−δ lines and vias on two wiring levels separated by an epitaxial insulating layer. Connection between the two YBa2Cu3O7−δ wiring layers was accomplished by the use of superconducting vias through the insulator. Two similar multilayer multichip module designs, with 30- and 10-μm-wide YBa2Cu3Oδ−7 lines, were constructed.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.108652
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