Publication Date:
2019-07-13
Description:
Packages protect and hold monolithic microwave integrated circuit (MMIC) chips while providing dc and radio-frequency (RF) electrical connections for chips undergoing development. Required to be compact, lightweight, and rugged. Designed to minimize undesired resonances, reflections, losses, and impedance mismatches.
Keywords:
ELECTRONIC COMPONENTS AND CIRCUITS
Type:
NPO-19436
,
NASA Tech Briefs (ISSN 0145-319X); 20; 5; P. 20a
Format:
text
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