ISSN:
1662-0356
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Natural Sciences in General
,
Technology
Notes:
This paper reviews a new, low-temperature process for soldering and brazing ceramics tometals that is based on the use of reactive multilayer foils as a local heat source. The reactive foilsrange in thickness from 40μm to 100μm and contain many nanoscale layers that alternate betweenmaterials with large heats of mixing, such as Al and Ni. By inserting a free-standing foil betweentwo solder (or braze) layers and two components, heat generated by the reaction of the foil melts thesolder (or braze) and consequently bonds the components. The use of reactive foils eliminates theneed for a furnace, and dramatically reduces the heating of the components being bonded. Thusceramics and metals can be joined over large areas without the damaging thermal stresses that aretypically encountered when cooling in furnace soldering or brazing operations. This paper draws onearlier work to review the bonding process and its application to a variety of ceramic-metal systems.Predictions of thermal profiles during bonding and the resulting residual stresses are described andcompared with results for conventional soldering or brazing processes. The microstructure,uniformity, and physical properties of the reactive foil bonds are reviewed as well, using severaldifferent ceramic-metal systems as examples
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/42/transtech_doi~10.4028%252Fwww.scientific.net%252FAST.45.1578.pdf
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