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  • 1
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    Ribozyme-mediated repair of sickle beta-globin mRNAs in erythrocyte precursors (1998)
    American Association for the Advancement of Science (AAAS)
    Details
    Publication Date: 1998-06-11
    Description: Sickle cell anemia is the most common heritable hematological disease, yet no curative treatment exists for this disorder. Moreover, the intricacies of globin gene expression have made the development of treatments for hemoglobinopathies based on gene therapy difficult. An alternative genetic approach to sickle cell therapy is based on RNA repair. A trans-splicing group I ribozyme was used to alter mutant beta-globin transcripts in erythrocyte precursors derived from peripheral blood from individuals with sickle cell disease. Sickle beta-globin transcripts were converted into messenger RNAs encoding the anti-sickling protein gamma-globin. These results suggest that RNA repair may become a useful approach in the treatment of genetic disorders.〈br /〉〈span class="detail_caption"〉Notes: 〈/span〉Lan, N -- Howrey, R P -- Lee, S W -- Smith, C A -- Sullenger, B A -- HL57606/HL/NHLBI NIH HHS/ -- New York, N.Y. -- Science. 1998 Jun 5;280(5369):1593-6.〈br /〉〈span class="detail_caption"〉Author address: 〈/span〉Center for Genetic and Cellular Therapies, Department of Surgery, Duke University Medical Center, Durham, NC 27710, USA.〈br /〉〈span class="detail_caption"〉Record origin:〈/span〉 〈a href="http://www.ncbi.nlm.nih.gov/pubmed/9616120" target="_blank"〉PubMed〈/a〉
    Keywords: Anemia, Sickle Cell/*blood/therapy ; Cloning, Molecular ; Erythroid Precursor Cells/*metabolism ; Exons ; Fetal Blood ; Genetic Therapy ; Globins/*genetics ; Humans ; Mutation ; Polymerase Chain Reaction ; *RNA Splicing ; RNA, Catalytic/genetics/*metabolism ; RNA, Messenger/chemistry/*genetics/metabolism ; Transfection ; Uridine/metabolism
    Print ISSN: 0036-8075
    Electronic ISSN: 1095-9203
    Topics: Biology , Chemistry and Pharmacology , Computer Science , Medicine , Natural Sciences in General , Physics
    Published by American Association for the Advancement of Science (AAAS)
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    PAPER CURRENT
  • 2
    Electronic Resource
    Electronic Resource
    Dielectric properties of metal-organic chemical vapor deposited highly textured Pb(ScTa)1−xTixO3 (x=0–0.3) relaxor ferroelectric thin films on LaNiO3 electrode buffered Si (1999)
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 75 (1999), S. 2485-2487 
    Details
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Highly (100) textured Pb(ScTa)1−xTixO3 (x=0–0.3) thin films were grown on LaNiO3/Pt/Ti electrode-coated Si substrate using metal-organic chemical vapor deposition at 685 °C. Ti addition was introduced to modify the dielectric properties. Diffuse phase transition, typical of relaxor ferroelectrics was noticed. As Ti content increased from 0% to 30%, the phase transition temperature (Tmax) gradually shifted from −10 to 120 °C with the dielectric constant at Tmax increased from 1397 to 1992 (1 kHz). Loss tangent values are generally below 0.025. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.125056
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  • 3
    Electronic Resource
    Electronic Resource
    Bound-to-continuum intersubband photoconductivity of self-assembled InAs quantum dots in modulation-doped heterostructures (1999)
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 75 (1999), S. 1428-1430 
    Details
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have designed and fabricated a quantum dot infrared photodetector which utilizes the lateral transport of photoexcited carriers in the modulation-doped AlGaAs/GaAs two-dimensional (2D) channels. A broad photocurrent signal has been observed in the photon energy range of 100–300 meV due to the bound-to-continuum intersubband absorption of normal incidence radiation in the self-assembled InAs quantum dots. A peak responsivity was as high as 4.7 A/W. The high responsivity is realized mainly by a high mobility and a long lifetime of photoexcited carriers in the modulation-doped 2D channels. Furthermore, it is found that the observed photosensitivity survives up to 190 K. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.124715
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  • 4
    Electronic Resource
    Electronic Resource
    Solder joint reliability of cavity-down plastic ball grid array assemblies (1998)
    Bradford : Emerald
    Soldering & surface mount technology 10 (1998), S. 26-31 
    Details
    ISSN: 0954-0911
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A computational model was established in this study to simulate cavity-down plastic ball grid array (PBGA) assemblies. Stress analysis was performed to investigate the solder joint reliability of a PBGA-PCB (printed circuit board) assembly. The packages under investigation had two different body sizes and two kinds of ball population. The diagonal cross-section of the assembly was modeled by plane-strain elements and was subjected to a uniform thermal loading. The solder joints were stressed due to the mismatch of the assembly's coefficient of thermal expansion (CTE). The accumulated effective plastic strain was evaluated as an index for the reliability of solder joints. Effects on solder joint reliability such as package size and ball population were identified. Furthermore, it was found that, unlike conventional PBGA assemblies, the outermost solder ball has the highest plastic strain for all cases in the present study. This peculiar phenomenon was further discussed with the consideration of package deformation.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/09540919810203829
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  • 5
    Electronic Resource
    Electronic Resource
    Dichloro(2,6-diisopropylaniline-N)(η5-pentamethylcyclopentadienyl)rhodium(III) (1999)
    Oxford [u.a.] : International Union of Crystallography (IUCr)
    Acta crystallographica 55 (1999), S. 722-724 
    Details
    ISSN: 1600-5759
    Source: Crystallography Journals Online : IUCR Backfile Archive 1948-2001
    Topics: Chemistry and Pharmacology , Geosciences , Physics
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1107/S0108270198014693
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  • 6
    Electronic Resource
    Electronic Resource
    (1R,2R)-(–)-[Bis(3,5-di-tert-butylsalicylidene)-1,2-cyclohexanediamine]chloromanganese(III), an (R,R)-Jacobsen catalyst (1999)
    Oxford [u.a.] : International Union of Crystallography (IUCr)
    Acta crystallographica 55 (1999), S. 1766-1769 
    Details
    ISSN: 1600-5759
    Source: Crystallography Journals Online : IUCR Backfile Archive 1948-2001
    Topics: Chemistry and Pharmacology , Geosciences , Physics
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1107/S0108270199009397
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  • 7
    Electronic Resource
    Electronic Resource
    Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages (1997)
    Bradford : Emerald
    Circuit world 23 (1997), S. 16-19 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: This paper presents a non-linear numerical study to investigate the effectof chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array(PBGA) packages. The package under investigation was a 225-pinfull-grid PBGA assembly. The diagonal cross-section of the PBGA togetherwith the printed circuit board (PCB) was modelled by plane-strain elements. A uniform thermal loading was applied and the solder joints were stressed due to the mismatchof coefficient of thermal expansion (CTE) and constructions of the PCB assembly. The effective stress and accumulated plastic strain of solder balls against various chipdimensions and substrate thicknesses were evaluated as an index for the reliability of solderjoints. The results of this study are helpful for electronics packaging engineers to optimise thegeometry of plastic ball grid array packages.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056129710800080
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  • 8
    Electronic Resource
    Electronic Resource
    [1,1'-Bis(diphenylphosphino)ferrocene]trichloro(phenylimido)rhenium(V) dichloromethane solvate (1999)
    Oxford [u.a.] : International Union of Crystallography (IUCr)
    Acta crystallographica 55 (1999), S. 2018-2020 
    Details
    ISSN: 1600-5759
    Source: Crystallography Journals Online : IUCR Backfile Archive 1948-2001
    Topics: Chemistry and Pharmacology , Geosciences , Physics
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1107/S0108270199011385
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  • 9
    Electronic Resource
    Electronic Resource
    Morphology of polymer/silicate nanocomposites High density polyethylene and a nitrile copolymer (1998)
    Springer
    Polymer bulletin 41 (1998), S. 107-113 
    Details
    ISSN: 1436-2449
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Summary Nanoscale composites of a modified silicate with either high-density polyethylene (HDPE) or a nitrile copolymer have been examined. Hydrophilic silicate clay was intercalated by ion exchange reaction of alkylammonium ions. X-ray diffraction (XRD) and transmission electron microscopy (TEM) results revealed that so-modified silicate layers were finely dispersed in these polymeric matrices. Instead of being individually dispersed, most layers were found in thin stacks comprising several swollen layers. Greater dispersion was found in the nitrile copolymer rather than in HDPE, suggesting differences in the degree of physical interaction with the modified clay. Lamellar crystals of HDPE formed parallel to the silicate layers.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s002890050339
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  • 10
    Electronic Resource
    Electronic Resource
    1.3 μm planar buried heterostructure distributed feedback lasers grown by four-step MOVPE (1995)
    Springer
    Optical and quantum electronics 27 (1995), S. 459-464 
    Details
    ISSN: 1572-817X
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Physics
    Notes: Abstract Data are presented on InGaAsP/InP planar buried heterostructure (PBH) distributed feedback (DFB) lasers operating at 1.3 μm. A four-step MOVPE process and holographic lithography are employed to fabricate these lasers. The CW laser threshold and the slope efficiency from these lasers are 9 mA and 0.23 mW mA-1 per facet at room temperature. Single-longitudinal-mode operation with side-mode suppression of more than 35 dB is obtained at 5 mW.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00563584
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