Publication Date:
2014-09-25
Description:
Highly scaled gate dielectric stacks with low leakage and low interface trap densities are required for complementary metal-oxide-semiconductor technology with III-V semiconductor channels. Here, we show that a novel pre-deposition technique, consisting of alternating cycles of nitrogen plasma and tetrakis(dimethylamino)titanium, allows for HfO 2 and ZrO 2 gate stacks with extremely high accumulation capacitance densities of more than 5 μ F/cm 2 at 1 MHz, low leakage current, low frequency dispersion, and low midgap interface trap densities (10 12 cm −2 eV −1 range). Using x-ray photoelectron spectroscopy, we show that the interface contains TiO 2 and small quantities of In 2 O 3 , but no detectable Ga- or As-oxides, or As-As bonding. The results allow for insights into the microscopic mechanisms that control leakage and frequency dispersion in high-k/III-V gate stacks.
Print ISSN:
0021-8979
Electronic ISSN:
1089-7550
Topics:
Physics
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