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    Impact of Scaled Technology on Radiation Testing and Hardening (2005)
    In:  CASI
    Details
    Publication Date: 2019-08-27
    Description: This presentation gives a brief overview of some of the radiation challenges facing emerging scaled digital technologies with implications on using consumer grade electronics and next generation hardening schemes. Commercial semiconductor manufacturers are recognizing some of these issues as issues for terrestrial performance. Looking at means of dealing with soft errors. The thinned oxide has indicated improved TID tolerance of commercial products hardened by "serendipity" which does not guarantee hardness or say if the trend will continue. This presentation also focuses one reliability implications of thinned oxides.
    Keywords: Solid-State Physics
    Type: Government Microcircuits Application Conference (GOMAC); Apr 07, 2005; Las Vegas, NV; United States
    Format: application/pdf
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