Publication Date:
2024-04-11
Description:
Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage.
Keywords:
TA1-2040
;
TK1-9971
;
T1-995
;
hydrophobic paper
;
n/a
;
conformal design
;
stretchability
;
stretchable circuits
;
long-term plasticity
;
tunnel encapsulation
;
bio-integrated devices
;
epidermal sensors
;
artificial synapses
;
droplet circuits
;
stretchable electronics
;
island-bridge
;
bottom-up approaches
;
liquid metal
;
feedback control
;
durability
;
dry/wet conditions
;
solution electronics
;
nano-fabrication
;
surface plasmon-polariton (SPP)
;
electronic measurements
;
Polyvinyl Alcohol
;
wireless power
;
quantum tunneling effect
;
low-cost manufacture
;
non-developable surface
;
top-down approaches
;
reliability
;
microwave photonics
;
tissue adhesives
;
temperature sensor
;
brain-like intelligence
;
electron transport
;
wearable stimulators
;
variable optical attenuator (VOA)
;
ionic conduction
;
design metrics
;
flexible electronics
;
flexible organic electronics
;
soft biological tissue
;
neuromorphic computing
;
wearable heater
;
quantum computing
;
epidermal electronics
;
tunable adhesion
;
paper electronics
;
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology
Language:
English
Format:
image/jpeg
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