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  • INSTRUMENTATION AND PHOTOGRAPHY  (3)
  • 2020-2024
  • 1985-1989  (3)
  • 1
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    A capacitive technique for real-time monitoring polymer coating thickness on carbon filaments during prepregging process (1989)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: A technique for gauging the coating thickness during prepreg processing of carbon fibers was developed. It is based on the concept of measuring the capacitance of a cylindrical condenser through which a bundle of prepregged fibers is passed axially. Empirical results indicate the capacitance of this condenser element is linearly related to the polymer coating thickness on the fibers in the bundle. The capacitive transducer was successfully used to measure the polymer thickness on several test fiber bundles under static conditions.
    Keywords: INSTRUMENTATION AND PHOTOGRAPHY
    Type: NASA-TM-101682 , NAS 1.15:101682
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 2
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    Piezoresistive silicon pressure sensors in cryogenic environment (1989)
    In:  Other Sources
    Details
    Publication Date: 2019-07-13
    Description: This paper presents data on low-temperature measurements of silicon pressure sensors. It was found that both the piezoresistance coefficients and the charge-carrier mobility increase with decreasing temperature. For lightly doped semiconductor materials, the density of free charge carriers decreases with temperature and can freeze out eventually. However, the effect of carrier freeze-out can be minimized by increasing the impurity content to higher levels, at which the temperature dependency of piezoresistance coefficients is reduced. An impurity density of 1 x 10 to the 19th/cu cm was found to be optimal for cryogenic applications of pressure sensor dies.
    Keywords: INSTRUMENTATION AND PHOTOGRAPHY
    Type: International Instrumentation Symposium; May 01, 1989 - May 04, 1989; Orlando, FL; United States
    Format: text
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    NASA TECHNICAL REPORTS
  • 3
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    A temperature and pressure controlled calibration system for pressure sensors (1989)
    In:  Other Sources
    Details
    Publication Date: 2019-07-13
    Description: A data acquisition and experiment control system capable of simulating temperatures from -184 to +220 C and pressures either absolute or differential from 0 to 344.74 kPa is developed to characterize silicon pressure sensor response to temperature and pressure. System software is described that includes sensor data acquisition, algorithms for numerically derived thermal offset and sensitivity correction, and operation of the environmental chamber and pressure standard. This system is shown to be capable of computer interfaced cryogenic testing to within 1 C and 34.47 Pa of single channel or multiplexed arrays of silicon pressure sensors.
    Keywords: INSTRUMENTATION AND PHOTOGRAPHY
    Type: International Instrumentation Symposium; May 01, 1989 - May 04, 1989; Orlando, FL; United States
    Format: text
    Location Call Number Expected Availability
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    NASA TECHNICAL REPORTS
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