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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Journal of electronic testing 6 (1995), S. 191-202 
    ISSN: 1573-0727
    Keywords: defects ; faults ; fault model ; I DDQ testing ; March test
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Abstract In this article, we outline a RAM test methodology taking into accountI DDQ and voltage based March tests. RAM test cost forms a significantly large portion of its total production cost and is projected to increase even further for future RAM generations.I DDQ testing can be utilized to reduce this cost. However, owing to architectural and operational constrains of RAMs, a straight forward application ofI DDQ testing has very limited defect detection capability. These constrains are removed by creating anI DDQ test mode in RAMs. All bridging defects in RAM matrix, including the gate oxide defects, are detected by fourI DDQ measurements. TheI DDQ test is then supplemented with voltage based March test to detect the defects (opens, data retention) that are not detectable usingI DDQ technique. The combined test methodology reduces the algorithmic test complexity for a given SRAM fault model from 16n to 5n+4I DDQ measurements.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Journal of electronic testing 6 (1995), S. 265-276 
    ISSN: 1573-0727
    Keywords: defects ; faults ; fault model ; fault dictionary ; inductive fault analysis
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Abstract Owing to the non-binary nature of their operation, analog circuits are influenced by process defects in a different manner compared to digital circuits. This calls for a careful investigation into the occurrence of defects in analog circuits, their modeling related aspects and their detection strategies. In this article, we demonstrate with the help of a real CMOS circuit that simple test stimuli, like DC, transient and AC, can detect most of the modeled process defects. Silicon devices tested with the proposed test methodology demonstrate the effectiveness of the method. Subsequently, the proposed test method is implemented in production test environment along with the conventional test for a comparative study. This test methodology is structured and simpler, therefore results in substantial test cost reduction.
    Type of Medium: Electronic Resource
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