Publikationsdatum:
2016-09-03
Beschreibung:
The microelectronic industry has been growing rapidly over the past 10-20 years, as has its reliance on thin-film deposition techniques for components manufacturing. As modern devices generate quite a bit of heat and peak temperatures can reach over 100°C, there is a need to provide adequate cooling for a device to stay operable. A series of chrome gold films with various thicknesses were prepared on silicon substrate. The structural and surface morphology, adhesion, friction, Young's modulus and hardness of this thin film were studied for three different thicknesses under temperature variations between 20 to 100°C. The variation of the film thickness and temperature affects the structure, surface and mechanical properties of Cr/Au thin films. Obviously these thermal cycles are unavoidable and eventually lead to thermal fatigue damage and device failure. Consequently, the knowledge of mechanical properties of thin films at elevated temperatures is required for proper chip design...
Print ISSN:
1757-8981
Digitale ISSN:
1757-899X
Thema:
Maschinenbau
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