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  • Aerodynamics
  • Electronics and Electrical Engineering
  • 2005-2009  (3)
  • 1925-1929
  • 2008  (3)
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  • 2005-2009  (3)
  • 1925-1929
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  • 1
    Publication Date: 2019-07-13
    Description: The second flight of the Hyper-X program afforded a unique opportunity to determine the aerodynamic force and moment characteristics of an airframe-integrated scramjet-powered aircraft in hypersonic flight. These data were gathered via a repeated series of pitch, yaw, and roll doublets, frequency sweeps, and pushover-pullup maneuvers performed throughout the X-43A cowl-closed descent. Maneuvers were conducted at Mach numbers of 6.80-0.95 and at altitudes from 92,000 ft mean sea level to sea level. The dynamic pressure varied from 1300 to 400 psf with the angle of attack ranging from 0 to 14 deg. The flight-extracted aerodynamics were compared with preflight predictions based on wind-tunnel test data. The X-43A flight-derived axial force was found to be 10-15%higher than prediction. Underpredictions of similar magnitude were observed for the normal force. For Mach numbers above 4.0, the flight-derived stability and control characteristics resulted in larger-than-predicted static margins, with the largest discrepancy approximately 5 in. forward along the x-axis center of gravity at Mach 6.0. This condition would result in less static margin in pitch. The predicted lateral-directional stability and control characteristics matched well with flight data when allowance was made for the high uncertainty in angle of sideslip.
    Keywords: Aerodynamics
    Type: AIAA Paper-2006-8028 , 14th AIAA/AHI Space Planes and Hypersonic Systems and Technologies Conference; Nov 06, 2006 - Nov 09, 2006; Canberra; Australia|Journal of Spacecraft and Rockets; 45; 3; 472-484
    Format: application/pdf
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  • 2
    Publication Date: 2019-07-13
    Description: This presentation discusses fractured leads on field-programmable gate array (FPGA) during flight vibration. Actions taken to determine root cause and resolution of the failure include finite element analysis (FEA) and vibration testing and scanning electron microscopy (with X-ray microanalysis) and energy dispersive spectrometry (SEM/EDS) failure assessment. Bonding methods for surface mount parts is assessed, including critical analysis and assessment of random fatigue damage. Regarding ceramic quad flat pack (CQFP) lead fracture, after disassembling the attitude control electronics (ACE) configuration, photographs showed six leads cracked on FPGA RTSX72SU-1 CQ208B package located on the RWIC card. An identical package (FPGA RTSX32SU-1 CQ208B) mounted on the RWIC did not results in cracked pins due to vibration. FPGA lead failure theories include workmanship issues in the lead-forming, material defect in the leads of the FPGA packages, and the insecure mounting of the board in the card guides, among other theories. Studies were conducted using simple calculations to determine the response and fatigue life of the package. Shorter packages exhibited more response when loaded by out-of-plane displacement of PCB while taller packages exhibit more response when loaded by in-plane acceleration of PCB. Additionally, under-fill did not contribute to reducing stress in leads due to out-of-plane PCB loading or from component twisting, as much as corner bonding. The combination of corner bond and under-fill is best to address mechanical and thermal S/C environment. Test results of bonded parts showed reduced (dampened) amplitude and slightly shifted peaks at the un-bonded natural frequency and an additional response at the bonded frequency. Stress due to PCBB out-of-plane loading was decreased on in the corners when only a corner bond was used. Future work may address CQFP fatigue assessment, including the investigation of discrepancy in predicted fatigue damage, as well as comparing fatigue life and fatigue damage cycle ration computed using FEA and Miner's rule to results from a fatigue assessment software program.
    Keywords: Electronics and Electrical Engineering
    Type: Military and Aerospace Programmable Logic Devices (MAPLD) Conference; Sep 15, 2008 - Sep 18, 2008; Annapolis, MD; United States
    Format: application/pdf
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  • 3
    Publication Date: 2019-07-13
    Description: Space Solar Power (SSP), combined with Wireless Power Transmission (WPT), offers the far-term potential to solve major energy problems on Earth. In the long term, we aspire to beam energy to Earth from geostationary Earth orbit (GEO), or even further distances in space. In the near term, we can beam power over more moderate distances, but still stretch the limits of today s technology. In recent studies, a 100 kWe-class "Power Plug" Satellite and a 10 kWe-class Lunar Polar Solar Power outpost have been considered as the first steps in using these WPT options for SSP. Our current assessments include consideration of orbits, wavelengths, and structural designs to meet commercial, civilian government, and military needs. Notional transmitter and receiver sizes are considered for use in supplying 5 to 40 MW of power. In the longer term, lunar or asteroidal material can be used. By using SSP and WPT technology for near-term missions, we gain experience needed for sound decisions in designing and developing larger systems to send power from space to Earth.
    Keywords: Electronics and Electrical Engineering
    Type: MSFC-2135 , State of Space Solar Technology; Oct 02, 2008 - Oct 03, 2008; Florida; United States
    Format: application/pdf
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