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  • Electronics and Electrical Engineering  (1)
  • Genetic Heterogeneity  (1)
  • 2000-2004  (2)
  • 2002  (2)
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  • 2000-2004  (2)
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  • 1
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    American Association for the Advancement of Science (AAAS)
    Publication Date: 2002-12-24
    Description: 〈br /〉〈br /〉〈a href="https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3276596/" target="_blank"〉〈img src="https://static.pubmed.gov/portal/portal3rc.fcgi/4089621/img/3977009" border="0"〉〈/a〉   〈a href="https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3276596/" target="_blank"〉This paper as free author manuscript - peer-reviewed and accepted for publication〈/a〉〈br /〉〈br /〉〈span class="detail_caption"〉Notes: 〈/span〉Bassett, Anne S -- Chow, Eva W C -- Vieland, Veronica J -- Brzustowicz, Linda -- 38099/Canadian Institutes of Health Research/Canada -- New York, N.Y. -- Science. 2002 Dec 20;298(5602):2277; author reply 2277.〈br /〉〈span class="detail_caption"〉Author address: 〈/span〉Department of Psychiatry, University of Torontoand Clinical Genetics Research Program, Centre for Addiction and Mental Health, 1001 Queen Street West, Toronto, Ontario M6J 1H4, Canada. anne.bassett@utoronto.ca〈br /〉〈span class="detail_caption"〉Record origin:〈/span〉 〈a href="http://www.ncbi.nlm.nih.gov/pubmed/12494945" target="_blank"〉PubMed〈/a〉
    Keywords: Chromosomes, Human, Pair 1/*genetics ; Female ; Genetic Heterogeneity ; *Genetic Linkage ; *Genetic Predisposition to Disease ; Humans ; Lod Score ; Male ; Pedigree ; Research Design ; Schizophrenia/ethnology/*genetics
    Print ISSN: 0036-8075
    Electronic ISSN: 1095-9203
    Topics: Biology , Chemistry and Pharmacology , Computer Science , Medicine , Natural Sciences in General , Physics
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  • 2
    Publication Date: 2018-06-08
    Description: Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5dB and return loss better than -17 dB from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split waveguide block packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe andantipodal finline.
    Keywords: Electronics and Electrical Engineering
    Type: Lester Eastman Conference on High Performance Devices; Ithaca, NY; United States
    Format: text
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