ISSN:
0730-6679
Keywords:
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In this article, a new encapsulation injection molding method for electronic devices such as integrated circuits (ICs) is described as a superior technology to the conventional transfer molding process widely used in the electronics industries. The quantitative analysis has been carried out utilizing a computer simulation program covering cavity-filling behavior to analyze the relationship between the deformation of gold wires that are bonded with mounted IC chips and mold geometries, operational conditions, and physical properties of a thermoplastic encapsulant, i.e., polyphenylene sulfide. As a result, a new technology to encapsulate ICs has been established, preventing no practical gold wire deformation or break-up damage. © 1993 John Wiley & Sons, Inc.
Additional Material:
20 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/adv.1993.060120106
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