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  • American Institute of Physics (AIP)  (11)
  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 8278-8284 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The x-ray rocking curve analysis was used to investigate damage accumulation with increasing dose in silicon implanted with 50 keV and 1 MeV 11B+ ions, and 50 keV, 180 keV, and 0.7 MeV 28Si+ ions. The damage buildup was studied by following the maximum value of lattice strain normal to the surface (ε⊥) and the depth integral of ε⊥. The ε⊥ profiles were obtained with a dynamical diffraction formalism by using automated best fits to experimental x-ray rocking curves. It is shown that, for doses below the amorphization limit, the damage increases sublinearly with dose and not very differently for B and Si ions. The sublinearity results from intercascade recombination of point defects produced under bombardment. The small differences, if real, in the sublinearities observed for the two ions could be explained by the different forms of aggregation to which the surviving defects evolve when the dose approaches the amorphization threshold. However, the study of damage growth must stop at the upper dose at which a continuous buried amorphous layer begins to form. In fact, starting from this dose, a simple semikinematical diffraction model shows that the determination of a unique peak value of ε⊥ depth profile, and hence of its integral, is not possible. This is the consequence of the fact that the sample behaves as an x-ray interferometer when an embedded amorphous layer is present. The analysis reported here is compared with similar studies recently published in the literature. © 1996 American Institute of Physics.
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 66 (1989), S. 4715-4718 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Measurements performed by x-ray diffraction techniques on silicon wafers implanted with silicon ions show that surface amorphous film and underlying interstitial defects are able to induce wafer convexity. The simulation of the rocking curves obtained by double-crystal diffraction before and after annealing, the measurement of the total vertical expansion of the implanted layer, the determination of the curvature radius, and the use of a theoretical model, directly compatible with the output of rocking curve simulation, recently developed for multilayered crystalline structures, allow us to determine the tangential stress depth distribution of the implanted wafer and the average relaxed volume expansion of the amorphous layer. The results obtained show that both stress and volume expansion increase with dose for a given ion-beam energy. A comparison is made with similar data reported recently in the literature for high-dose arsenic-implanted silicon.
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 65 (1989), S. 98-104 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Phosphorus was implanted at doses below amorphization threshold in virgin silicon and in silicon containing interstitial dislocation loops. The loops were formed by high-dose Si+ implantation and 900 °C, 30 min annealing. Triple-crystal x-ray diffraction and junction depth measurements combined with secondary ion mass spectrometry were used for the analysis of implant defects and the determination of P distribution, respectively. Annealings were carried out in furnace in the range between 600 and 900 °C, and by electron beam at 1000 °C for 10 s. The results obtained show that the presence of loops strongly reduces the phosphorus anomalous diffusion. This phenomenon is the consequence of the absorption by the loops of the interstitial excess coming from dissolution of the clusters produced by the P implant. The influence of the loop position with respect to the P distribution on the extent of P diffusivity is analyzed and discussed.
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 62 (1987), S. 1723-1728 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Lattice damage has been introduced in silicon wafers by silicon ion implantation at doses below and above amorphization threshold. In the first case, the annealing behavior of damage is consistent with the presence of amorphous islands near the surface and interstitial clusters in deeper regions. Unlike the former kind of defects, the temperature evolution of the latter strongly affects the diffusion of dopant atoms. Enhanced diffusion for dopant diffusing via interstitialcy mechanism accompanies in fact the interstitial cluster dissolution. The extent of this effect depends on the relative depth position of dopant and defects. When the local concentration of the interstitials increases (e.g., as a consequence of an implant made with the same dose, but with a lower energy) defect clustering begins to compete with their recovery, which makes the fraction of interstitials available for dopant diffusion smaller. Interstitial clustering is the dominant process occurring during annealing at the original amorphous-crystal interface in a high-dose implanted sample. Dislocation loops are then formed and evolve (increase in size, decrease of density) via dissolution of the small clusters in the damage tail. The process is accompanied by a net reduction of the interstitials collapsed in the residual dislocation loops. The consequence is a supersaturation of interstitials, which assists the movement of the dopant, if initially localized at depths greater than loop position. Conversely, when the dopant junction is shallower than the original amorphous layer, negligible enhanced diffusion occurs, which indicates an effective sink action of the loops for the interstitials coming from cluster dissolution.
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 88 (2000), S. 3993-3999 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Deep distributions of lattice disorder induced in Si by room temperature, high-energy (3 MeV), nonamorphizing As ion implants have been characterized by Rutherford backscattering spectrometry channeling (RBS-C), double crystal x-ray diffractometry (DCXD), and cross-sectional transmission electron microscopy (XTEM). After accurate calibration of the measurement conditions, the depth positions of the profiles of displaced atoms, lattice strain, and XTEM weak-beam dark-field contrast in a sample implanted at a dose of 1014 As cm−2 agree within 3%. This confirms that the quantities measured by the three techniques have a similar qualitative correlation with the depth profile of as-implanted damage. The shape of the disorder profiles indicates different rates of damage accumulation as a function of depth, which have been characterized by a series of DCXD measurements at doses in the range 1012–1014 As cm−2. The problem of a quantitative determination of the number of defects is also addressed. In particular, the result of RBS-C, which gives as output the concentration of displaced atoms, is sensitive to the configuration of damage assumed when fitting experimental spectra. As a consequence, to give a reliable estimate of defect number a more refined microstructural model of damage (including, for instance, the deformation induced in the background lattice by heavily displaced atoms) should be used within the simulation of the measurement process. © 2000 American Institute of Physics.
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 61 (1987), S. 1834-1840 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The influence of the lattice defects induced by silicon-ion implantation on the B, P, As, and Sb diffusivities is investigated after annealing between 700 and 900 °C. The nature and depth position of the residual implantation defects in undoped samples is determined by the analysis of the rocking curves obtained by triple-crystal x-ray diffraction and transmission electron microscopy. In particular, besides the interstitial dislocation loops and clusters below the original amorphous-crystal interface, the epitaxial regrowth of the amorphized silicon leaves a vacancy-rich surface layer and a deeper region enriched in interstitials. These regions correspond to those where Monte Carlo simulations of defect production foresee excess point defects. Accordingly, as the dopant is located in correspondence with the vacancy or interstitial clusters, different behaviors of anomalous diffusion are observed. In the deep region where an interstitial excess is present, B and P show marked enhanced diffusion, while only a small enhancement is exhibited by As and Sb. On the contrary, retarded diffusivity for B and light enhancement for As and Sb are observed in the surface layer. These different trends are consistent with the different accepted contributions of vacancies and interstitials to the diffusion mechanisms of the investigated dopants.
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 2644-2649 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Solid-phase epitaxial growth was studied in germanium-implanted 〈100〉 silicon wafers as a function of germanium fluence, annealing temperature, and time. MeV He Rutherford backscattering in channeling conditions, cross-sectional transmission electron microscopy, double-crystal x-ray diffraction, and secondary-ion mass spectroscopy techniques were used to characterize the samples. At low fluences, up to 1×1015 cm−2 at 130 keV, the crystallization kinetics is similar to that measured on self-amorphized silicon. In the high-dose samples, prepared by multiple implants with a total dose of 3.12×1016 cm−2, the growth rate at fixed temperatures decreases. A comparison with literature data, obtained by similar experiments performed on amorphized uniform GexSi100−x films prepared by molecular-beam epitaxy or chemical-vapor deposition, reveals that the concentration gradient, unavoidable in implanted samples mainly at the end of the ion range region, is strictly connected with the observed decrease.
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 74 (1993), S. 2359-2369 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: B-Si and Ge-Si thin-film solid solutions on silicon at different compositions are analyzed by multiple-crystal x-ray diffraction. Computer simulations of the rocking curves are made with a diffraction model which, for dilute alloys, does not differ from that commonly reported in the literature. For sufficiently high solute atomic fractions, modifications are introduced to the Fourier coefficients of the crystal polarizability and to the parameters depending on the lattice strain. In the B-Si case, the comparison between strain and carrier profiles resulting from the simulations and electrical measurements, respectively, gives information on the fraction of substitutional B, the presence of precipitates, and their coherent or incoherent nature. In the Ge-Si case, the solute fraction, its depth gradient, and the static atomic disorder in the alloy are determined by means of the modified diffraction model. In particular, the determination of the atomic displacements around the lattice points in fully strained thin-film Ge-Si alloys give results larger than those evaluated by Monte Carlo calculations for relaxed solid solutions.
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  • 9
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Laser-annealed and further thermally annealed arsenic implanted silicon specimens have been investigated in a range of doses from 1×1016 to 5×1016 As/cm2, with different experimental techniques: electrical measurements, transmission electron microscopy (TEM), double-crystal x-ray diffractometry (DCD), and extended x-ray absorption fine structure analysis (EXAFS). On the as laser-annealed samples, in the whole range of doses examined, a lattice contraction of the doped layer has been evidenced by DCD, whereas, on the same specimens, EXAFS measurements have shown the presence of a local expansion around substitutional As atoms. The relationship between strain and carrier concentration has been found to be approximately linear and can be described by the presence of a size and an electronic effect, as recently proposed in the literature. The former effect represents the atomic size contribution, while the latter is the strain induced by the variation of the conduction-band minima due to the doping. After a subsequent thermal annealing in a low-temperature range (350–550 °C), a strong deactivation of the dopant has been evidenced by electrical measurements. From the experimental results, a new model of the first step of the As deactivation phenomenon at low temperature is proposed. It is described by the capture of two electrons from a pair of As atoms in the second neighbor position in the Si lattice, leading to the formation of a positively charged arsenic-vacancy cluster (As2V)+, and to the emission of a negatively charged Si self-interstitial I−. This model takes into account the main phenomena that are experimentally observed simultaneously to the As deactivation, i.e., the transition from a contraction to a dilatation of the strain observed by DCD and the formation of interstitial loops. At relatively high temperatures (650–900 °C), the hypothesis of the coexistence of the clusters and of the observed precipitates has to be taken into account in order to explain the nature of the inactive As. However, whether clustering or precipitation is the dominant phenomenon still remains an open question.
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 51 (1987), S. 331-333 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A dependence of boron anomalous diffusion on defect depth position has been observed after furnace and electron beam annealing of samples damaged with 28Si ions implanted at different energies. This behavior was correlated with the vacancy and interstitial excesses, produced under bombardment in the surface region and in depth, respectively. The spatial separation of these point defects was evidenced by the analysis of the intensity profiles obtained by double-crystal x-ray diffraction.
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