Publikationsdatum:
2011-06-27
Beschreibung:
In the present work, we investigate the problem of multiple cracks on the interface between a piezoelectric layer and an orthotropic substrate. The method of dislocation simulation and singular integral equation are used to solve the crack problem. The theoretical derivation is verified by the classical result in a special case. Numerical results of the stress intensity factor are obtained, and thereby the effects of geometrical parameters and material orthotropy are surveyed. The optimal stiffness ratio of the orthotropic substrate is suggested for the purpose of interfacial fracture prevention, which is significant for the design and assessment of such a kind of smart structures. Content Type Journal Article Pages 1-12 DOI 10.1007/s00707-011-0506-y Authors Fei-Xiang Feng, Academy of Armored Force Engineering, Beijing, 100072 China Kang Yong Lee, School of Mechanical Engineering, Yonsei University, Seoul, 120-749 Republic of Korea Yong-Dong Li, Academy of Armored Force Engineering, Beijing, 100072 China Journal Acta Mechanica Online ISSN 1619-6937 Print ISSN 0001-5970
Print ISSN:
0001-5970
Digitale ISSN:
1619-6937
Thema:
Maschinenbau
,
Physik
