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  • 1
    Publication Date: 2019-08-15
    Description: As with most elements of infrastructure, electrical wiring is innocuous; usually hidden away and unnoticed until it fails. Failure of infrastructure, however, sometimes leads to serious health and safety hazards. Electrical wiring fails when the polymeric (usually rubber) insulation material that sheathes the conductor gets embrittled with age from exposure to pressure, temperature or radiation cycling or when the insulation gets removed by the chafing of wires against each other. Miles of such wiring can be found in typical aircraft, with significant lengths of the wiring immersed in aviation fuel - a recipe for an explosion if a spark were to occur. Diagnosing the health of wiring is thus an important aspect of monitoring the health of aging aircraft. Stress wave propagation through wiring affords a quick and non-invasive method for health monitoring. The extent to which a stress wave propagating through the cable core gets attenuated depends on the condition of the surrounding insulation. When the insulation is in good condition - supple and pliable, there is more damping or attenuation of the waveform. As the insulation gets embrittled and cracked, the attenuation is likely to reduce and the waveform of the propagating stress wave is likely to change. The monitoring of these changes provides a potential tool to evaluate wiring or cabling in service that is not accessible for visual inspection. This experiment has been designed for use in an introductory mechanical or materials engineering instrumentation lab. Initial setup (after procuring all the materials) should take the lab instructor about 4 hours. A single measurement can be initiated and saved to disk in less than 3 minutes, allowing for all the students in a typical lab section to take their own data rather than share a single set of data for the entire class.
    Keywords: Electronics and Electrical Engineering
    Type: National Educators' Workshop: Update 2003. Standard Experiments in Engineering, Materials Science, and Technology, Part 1; 245-256; NASA/CP-2004-213243/PT1
    Format: application/pdf
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