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    Electronic Resource
    Electronic Resource
    PO Box 1354, 9600 Garsington Road, Oxford OX4 2XG, UK. : Blackwell Science Ltd
    Fatigue & fracture of engineering materials & structures 28 (2005), S. 0 
    ISSN: 1460-2695
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: In view of the pressing need for improvements in space mechanisms and tribology research work, a thermal high-vacuum mechanism test facility has been constructed at Rome ‘La Sapienza’ University. The purpose of this facility is to provide fundamental data on the performance of mechanical components and materials in high vacuum in order to test the validity of space mechanism designs. The facility also makes it possible to examine the behaviour of both mechanisms and materials under combined environmental factors, such as ultraviolet radiation, atomic oxygen and temperature. This paper reports on the behaviour of titanium recirculating ball screws provided by Umbra Cuscinetti SpA (Foligno, Italy) under thermal-vacuum conditions. It is to be noted that these ball screws—well known in the aeronautical field—may be particularly attractive as a new generation of space mechanisms. A solid multilayer film of tungsten carbide/carbon (WC/C) was deposited on screw surfaces as a lubricant and was then compared with the case of no lubrication, which presently appears promising for many mechanisms. In order to compare experimental results, traditional stainless steel mechanisms were also tested and analysed. The requisites imposed by the space environment, as well as by contact mechanical stresses, have given useful information on a preliminary geometrical configuration and choice of materials, both of which are presented in this paper. Thermal-vacuum effects on overall ball screw efficiency and on ball screw coating friction and wear are also reported and commented on herein as well as numerical contact simulations of crack mechanisms.
    Type of Medium: Electronic Resource
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