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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 336-338 (Apr. 2007), p. 765-768 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: In this study, shrinkage behavior and coefficient of thermal expansion (CTE) of novelnickel (Ni) powder with an addition of dielectric material, BaTiO3, have been investigated to reducethe large shrinkage mismatch between Ni electrode and dielectric material and to control the thermaland/or residual stresses created by CTE mismatch in MLCCs (multilayer ceramic capacitors). Forwhich two kinds of Ni powders were used. The component of Ni powders is analyzed by XRF, and thethermal behavior is measured by TG/DTA. The Ni and BaTiO3 powders were mixed with 9:1, 8:2,and 7:3 volume ratios. The BaTiO3-added Ni green bodies were fabricated through cold isostaticpressing, and then sintered to 1300°C in a reduction atmosphere. The shrinkage behavior with volumeratio was checked during sintering from 700 to 1300°C with 300°C interval. The CTE was measuredin inert (argon) atmosphere with sintered samples. It is found that the shrinkage behavior and the CTEof Ni electrode are dependent on the volume of BaTiO3 added. The particle size of Ni powder alsoaffects the microstructure and its sintering density, with less effect of its component
    Type of Medium: Electronic Resource
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