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  • 1
    Electronic Resource
    Electronic Resource
    Hoboken, NJ : Wiley-Blackwell
    Journal of Polymer Science 6 (1951), S. 625-631 
    ISSN: 0022-3832
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Notes: A conservative estimate of the molecular forces involved in the adhesion of polymers to conducting surfaces leads to bond tensile strengths considerably above those realizable in practice. This is explained by the occurrence of flaws, thermal stresses, and deformation under load. In order to minimize these factors, very thin films of polystyrene and polyethylene were molded between steel cylinders and experimental conditions were carefully controlled with the result that joint strengths in excess of bulk tensile strengths were obtained. Curves of joint failure stress versus film thickness at various temperatures are given, and extrapolated to zero thickness. The extrapolated adhesion values represent a lower limit of the specific adhesion. At 25°C. they are 183 kg./cm.2 for polyethylene, and 412 kg./cm.2 for polystyrene.
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
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