ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Dielectric and rheological measurements are reported for the cure in a series of mixtures of an epoxy-acrylate with n-butyl methacrylate. The level of the initiator and properties of the epoxy acrylate and n-butyl methacrylate influence the cure characteristics and morphology of the film formed. Analysis of the rheological data indicates that during the curing process, microphase separation occurs within the mixture. The changes in the dielectric relaxation behavior with composition of the completely cured material is also consistent with microphase separation occurring in these resins while they are cured.
Additional Material:
7 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760350211
