Publication Date:
2024-04-11
Description:
Due to the ever-expanding applications of micro/nano-electromechanical systems (NEMS/MEMS) as sensors and actuators, interest in their development has rapidly expanded over the past decade. Encompassing various excitation and readout schemes, the MEMS/NEMS devices transduce physical parameter changes, such as temperature, mass or stress, caused by changes in desired measurands, to electrical signals that can be further processed. Some common examples of NEMS/MEMS sensors include pressure sensors, accelerometers, magnetic field sensors, microphones, radiation sensors, and particulate matter sensors. Despite a long history of development, fabrication of novel MEMS/NEMS devices still poses unique challenges due to their requirement for a suspended geometry; and many new fabrication techniques have been proposed to overcome these challenges. However, further development of these techniques is still necessary, as newer materials such as compound semiconductors, and 2-dimensional materials are finding their way in various MEMS/NEMS applications, with more complex structures and potentially smaller dimensions.
Keywords:
TA1-2040
;
T1-995
;
vibrating ring gyroscope
;
n/a
;
tunnel magnetoresistive effect
;
optical sensor
;
micro-NIR spectrometer
;
pulse inertia force
;
gas sensor
;
wet etching
;
oil detection
;
glass welding
;
spring design
;
power consumption
;
MEMS (micro-electro-mechanical system)
;
back cavity
;
deflection position detector
;
magnetic
;
MEMS
;
single-layer SiO2
;
frequency tuning
;
threshold accuracy
;
suspended micro hotplate
;
AlGaN/GaN circular HFETs
;
quadrature modulation signal
;
inertial switch
;
nanoparticle sensor
;
low noise
;
photonic crystal nanobeam cavity
;
floating slug
;
infrared image
;
backstepping approach
;
microdroplet
;
acceleration switch
;
microgyroscope
;
temperature uniformity
;
methane
;
microfluidic
;
accelerometer design
;
photonic crystal cavity
;
anisotropy
;
resonant frequency
;
dual-mass MEMS gyroscope
;
analytical model
;
single crystal silicon
;
temperature sensor
;
micro fluidic
;
refractive index sensor
;
microwave measurement
;
low zero-g offset
;
femtosecond laser
;
micropellistor
;
rapid fabrication
;
accelerometer
;
tracking performance
;
GaN diaphragm
;
microactuator
;
resistance parameter
;
optomechanical sensor
;
scanning grating mirror
;
GaAs MMIC
;
adaptive control
;
frequency split
;
frequency mismatch
;
electrostatic force feedback
;
thermoelectric power sensor
;
squeeze-film damping
;
silicon
;
wideband
;
Accelerometer readout
;
bonding strength
;
high temperature pressure sensors
;
3D simulation
;
level-set method
;
tetramethylammonium hydroxide (TMAH)
;
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology
Language:
English
Format:
application/octet-stream
