ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Fatigue tests of nanometer-thick Cu films as deposited and annealed in vacuum wereconducted under constant load ranges at room temperature. Fatigue strengths of the Cu films, which isdefined as the critical load range being able to cause crack initiation within 106 cycles, are determined.The experimental results show that fatigue strength increases with decreasing film thickness. Fatiguecracking behaviors were characterized by electron microscope. It is also found that fatigue crackingresistance is dependent on film thickness and increases with decreasing film thickness. Size effects onfatigue properties of the nanometer-thick Cu films are discussed
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.353-358.116.pdf
