Publication Date:
2015-09-24
Description:
Author(s): James R. Kermode, Anna Gleizer, Guy Kovel, Lars Pastewka, Gábor Csányi, Dov Sherman, and Alessandro De Vita A thermally activated fracture process can occur in silicon without bonds breaking at the crack tip. For such a process cracks can propagate at speeds well below 2000 ms^{-1}, which were previously thought to be ‘forbidden’. [Phys. Rev. Lett. 115, 135501] Published Wed Sep 23, 2015
Keywords:
Condensed Matter: Structure, etc.
Print ISSN:
0031-9007
Electronic ISSN:
1079-7114
Topics:
Physics
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