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  • Institute of Electrical and Electronics Engineers (IEEE)
  • Springer Science + Business Media
  • 2010-2014  (25,417)
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  • 1
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    Mobile backhaul for small cells [Guest Editorial] (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
    Details
    Publication Date: 2013-09-07
    Description: Mobile broadband services have expanded considerably in recent years, driving operators to improve and densify their radio access network (RAN). It has become clear that small cells as well as macrocells must be included in a heterogeneous network, due to the scale of densification required. In order to maximize the end user experience, some level of radio coordination between these small and macrocells is needed ?? this coordination will be signaled across a mobile backhaul network. Mobile backhaul typically refers to the network between the base station site and the network controller site, but can also include interconnection between base station sites. Mobile backhaul includes a spectrum of networks and network technologies, including the RAN and core networks. There is considerable market interest on the development of small cell backhaul solutions that are an evolution of existing backhaul networks. Packet synchronisation mechanisms that are being developed are key to support the mobile backhaul application. Various standards bodies such as the Next Generation Mobile Networks Alliance (NGMN), Small Cell Forum (SCF), Metro Ethernet Forum (MEF), and Broadband Forum (BBF) are also studying what the implications would be on their defined mobile backhaul network architectures.
    Print ISSN: 0163-6804
    Electronic ISSN: 1558-1896
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Communications Society.
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  • 2
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    Heterodyne Random Bit Generation Using an Optically Injected Semiconductor Laser in Chaos (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
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    Publication Date: 2013-09-07
    Description: Heterodyne generation of parallel random bit streams from chaotic emission of an optically injected semiconductor laser is investigated. The continuous-wave optical injection invokes chaotic dynamics in the laser. The broadband chaotic emission is detected through optical heterodyning and electrical heterodyning into different channels. The channels digitize the signals into parallel independent random bit streams. Because of efficient utilization of different portions of the chaos bandwidth, heterodyne detections enable parallel generation of random bit streams, offer high total output bit rates, and require no high-bandwidth analogue-to-digital converters. In the experiment, two optical heterodyne channels and four electrical heterodyne channels are implemented. Each channel is required to digitize only 2.5 GHz of a much broader chaos bandwidth. The sampling rate is 10 GHz with five least significant bits selected from every 8-bit sample. The total output bit rate reaches 100 Gb/s and 200 Gb/s for optical and electrical heterodyning, respectively. The standard test suite of the National Institute of Standards and Technology verifies the randomness of both individual and interleaved output bit streams.
    Print ISSN: 0018-9197
    Electronic ISSN: 1558-1713
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Photonics Society.
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  • 3
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    EstiNet openflow network simulator and emulator (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
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    Publication Date: 2013-09-07
    Description: In this article, we introduce the EstiNet OpenFlow network simulator and emulator, and present its support for testing the functions and evaluating the performances of software-defined networks?? OpenFlow controller??s application programs. EstiNet uses an unique kernel reentering simulation methodology to enable unmodified real applications to run on nodes in its simulated network. As a result, without any modification, real NOX/POX or Floodlight OpenFlow controllers can readily run on a host in an EstiNet simulated network to control thousands of simulated OpenFlow switches. EstiNet has the characteristics of a simulator and an emulator at the same time. It combines the advantages of the simulation and emulation approaches without their respective shortcomings. EstiNet uses real OpenFlow controller programs, real network application programs, and the real TCP/IP protocol stack in the Linux kernel to generate correct, accurate, and repeatable SDN application performance results. In this article, we compare EstiNet with ns-3 and Mininet regarding their capabilities, performance, and scalability.
    Print ISSN: 0163-6804
    Electronic ISSN: 1558-1896
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Communications Society.
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  • 4
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    Advanced wireless and optical technologies for small-cell mobile backhaul with dynamic software-defined management (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
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    Publication Date: 2013-09-07
    Description: This article discusses novel wireless and optical technologies to address the radical new challenges of small cell mobile backhaul (MBH). Specifically, we examine 60 GHz and 70??80 GHz millimeter-wave technologies for high-capacity last mile and pre-aggregation backhaul, and orthogonal frequency-division multiple access passive optical networks as the optical technology complement for enabling flexible cost-efficient hybrid backhaul coverage. Flexible high-capacity hybrid millimeter wave/optical MBH network operation is next verified via network simulations in the context of a demanding, urban small-cell backhaul application. Finally, a novel software defined networking tool called the backhaul resource manager is introduced for automated dynamic resource provisioning and capacity-aware path computation that improves fairness, network utilization and end-to-end user quality of experience. The introduction of the novel wireless, optical, and software-defined technologies thus has the potential to truly revolutionize the future MBH network.
    Print ISSN: 0163-6804
    Electronic ISSN: 1558-1896
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Communications Society.
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  • 5
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    Non-line-of-sight small cell backhauling using microwave technology (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
    Details
    Publication Date: 2013-09-07
    Description: In this article we discuss different technology alternatives for small cell backhaul, and we present high-frequency microwave technology as a very interesting alternative for wireless backhauling of small cells. In fact, we demonstrate that high-frequency microwave technology can be used for NLOS wireless backhauling of small cells, which opens up new applications for microwave technology. We discuss urban NLOS channel propagation at high frequencies, and we show both measurement and simulation results to validate the use of high-frequency microwave technology for NLOS small cell backhaul.
    Print ISSN: 0163-6804
    Electronic ISSN: 1558-1896
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Communications Society.
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  • 6
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    Three-Dimensional Flexible Thermal Sensor for Intravascular Flow Monitoring (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
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    Publication Date: 2013-09-07
    Description: A novel design and assembly technology is developed for a three-dimensional (3-D) flexible thermal flow sensor based on convective heat transfer to reduce detection error caused by position variation of a sensor inside the flow of narrow and curved geometries, such as coronary artery. The 3-D sensor has three independent sensing elements equally distributed around the catheter tube. This arrangement introduces three independent information channels, and cross-comparisons are used to provide accurate flow measurement. The resistance of the sensing elements is measured at ${sim}{1}-1.2~{rm k}Omega$ with the temperature coefficient of resistance at $0.086%/^{circ}{rm C}$ . Using a constant-current circuit, the three sensing elements are heated to ${sim}10^{circ}{rm C}$ above ambient temperature. Flow testing is implemented in a pipe channel at two positions: on the wall and along the center line. Experimental results from these two positions are discussed and computational fluid dynamic simulation based on Newtonian fluid properties is implemented, showing comparable results within an acceptable range of experimental to simulation errors. Therefore, we demonstrate the capability of 3-D thermal flow sensor for detecting the position of the catheter in the flow channel, thereby providing an accurate flow measurement.
    Print ISSN: 1530-437X
    Electronic ISSN: 1558-1748
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Sensors Council.
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  • 7
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    Understanding user behavior in online social networks: a survey (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
    Details
    Publication Date: 2013-09-07
    Description: Currently, online social networks such as Facebook, Twitter, Google+, LinkedIn, and Foursquare have become extremely popular all over the world and play a significant role in people??s daily lives. People access OSNs using both traditional desktop PCs and new emerging mobile devices. With more than one billion users worldwide, OSNs are a new venue of innovation with many challenging research problems. In this survey, we aim to give a comprehensive review of state-of-the-art research related to user behavior in OSNs from several perspectives. First, we discuss social connectivity and interaction among users. Also, we investigate traffic activity from a network perspective. Moreover, as mobile devices become a commodity, we pay attention to the characteristics of social behaviors in mobile environments. Last but not least, we review malicious behaviors of OSN users, and discuss several solutions to detect misbehaving users. Our survey serves the important roles of both providing a systematic exploration of existing research highlights and triggering various potentially significant research in these topics.
    Print ISSN: 0163-6804
    Electronic ISSN: 1558-1896
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Communications Society.
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  • 8
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    Inkjet Printed All-Polymer Flexural Plate Wave Sensors (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
    Details
    Publication Date: 2013-09-07
    Description: We discuss the fabrication and performance of an all-polymer, flexural plate wave gravimetric sensor using flexible, piezoelectric Polyvinylidene fluoride as the substrate and an inkjet-printed interdigital transducer (IDT) employing conductive poly(3, 4-ethylenedioxythiophene) poly(styrenesulfonate) to excite Lamb waves within the film. Lamb waves are measured both electronically, using a second IDT, and mapped directly using a scanning laser Doppler vibrometer. Pulsed wave excitation is utilized to isolate the weak acoustic signal from the electromagnetic crosstalk, enabling the measurement of relative changes in the resonant frequency, $Delta f/f_{0}$ , in response to added mass, $Delta m$ , to the sensing area. A gravimetric mass sensitivity equivalent to $Delta f/(f_{0}Delta m)=-153~{rm cm}^{2}/{rm g}$ is measured by mass loading the sensor with printed polymer layers. It is found that the low stiffness of the substrate contributes significantly to the response of the sensor, yielding a measured overall sensitivity of $Delta f/(f_{0}Delta m)=-83~{rm cm}^{2}/{rm g}$ .
    Print ISSN: 1530-437X
    Electronic ISSN: 1558-1748
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Sensors Council.
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  • 9
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    Piezoelectric Polymer Transducer Arrays for Flexible Tactile Sensors (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
    Details
    Publication Date: 2013-09-07
    Description: In this paper, we propose a novel technological approach for the implementation of large-area flexible artificial skin based on arrays of piezoelectric polymer transducers. Polyvinylidene fluoride (PVDF) transducers are chosen for the high electromechanical transduction frequency bandwidth (up to 1 kHz). A low-cost and scalable technique for extracting PVDF signals is used to directly provide the piezoelectric film with patterned electrodes. If the skin is meant to cover large areas of a robot body, specific requirements have to be fulfilled from the point of view of the overall system and of the technology. Experimental tests on the prototype skin modules demonstrate the feasibility of the proposed approach and reveal the potentiality to build large area flexible skin.
    Print ISSN: 1530-437X
    Electronic ISSN: 1558-1748
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Sensors Council.
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  • 10
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    Bendable Ultra-Thin Chips on Flexible Foils (2013)
    Institute of Electrical and Electronics Engineers (IEEE)
    Details
    Publication Date: 2013-09-07
    Description: This paper presents ultra-thin silicon chips (flex–chips) on flexible foils, realized through post-processing steps such as wafer thinning, dicing, and transferring the thinned chips to flexible polyimide foils. The cost effective chemical etching is adopted for wafer thinning and the transfer printing approach, to transfer quasi 1-D structures such as micro/nanoscale wires and ribbons, that is adapted for transferring large ultra-thin flex–chips (widths 4.5–15 mm, lengths 8–36 mm, and thickness ${approx}{rm 15}~mu{rm m}$ ). The post-processing capability is demonstrated with passive structures such as metal interconnects realized on the flex–chips before carrying out the chip thinning step. The resistance values of metal interconnects do not show any appreciable change because of bending of chips for the tested range viz., radius of curvature 9 mm and above. Further, the bending mechanics of silicon membranes on foil is investigated to evaluate the bending limits before a mechanical fracture/failure occurs. The distinct advantages of this paper are: attaining bendability through post-processing of chips, cost effective fabrication process, and easy transfer of chips to the flexible substrates without using conventional and sophisticated equipment such as pick and place set up.
    Print ISSN: 1530-437X
    Electronic ISSN: 1558-1748
    Topics: Electrical Engineering, Measurement and Control Technology
    Published by Institute of Electrical and Electronics Engineers (IEEE) on behalf of The IEEE Sensors Council.
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