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Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte

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Abstract

The corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy in 6 M potassium hydroxide electrolyte was investigated using polarization analysis. The results revealed that SAC305 is susceptible to corrosion because of the dissolution of the Sn phase. The corrosion potential (E corr) and corrosion current density (i corr) obtained from the sample was –1.108 V vs Hg/HgO and 1.795 × 10−4 A cm−2, respectively. In addition, microstructural and elemental characterization revealed the presence of tin oxide, Cu, and/or Ag-containing corrosion product on the surface of the corroded sample. The morphology of the samples was also observed to contain several pits, cracks, and pore-like structures.

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Acknowledgments

The authors would like to thank USM for the financial support via Short Term Grant 304/Pbahan/60311005 and RU Grant 1001/Pbahan/814112.

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Authors and Affiliations

  1. School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, Malaysia

    Mui Chee Liew (Student), Ibrahym Ahmad (Student), Liu Mei Lee (Student), Muhammad Firdaus Mohd Nazeri (Student), Habsah Haliman (Research Officer) & Ahmad Azmin Mohamad (Lecturer)

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  1. Mui Chee Liew
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  2. Ibrahym Ahmad
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  3. Liu Mei Lee
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  4. Muhammad Firdaus Mohd Nazeri
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Correspondence to Ahmad Azmin Mohamad.

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Manuscript submitted December 5, 2011.

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Liew, M.C., Ahmad, I., Lee, L.M. et al. Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte. Metall Mater Trans A 43, 3742–3747 (2012). https://doi.org/10.1007/s11661-012-1194-5

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