Precision laser slicing technology for single-crystal SiC wafer
Released on J-STAGE: May 08, 2021 | Volume 64 Issue 12 Pages 635-642
Yohei YAMADA, Tomohiro IKEDA, Junichi IKENO
Influence of wheel-workpiece speed ratio of turn grinding on grinding force and surface roughness
Released on J-STAGE: December 17, 2020 | Volume 64 Issue 4 Pages 201-207
Ryo YAMAZAKI, Minoru OTA, Kai EGASHIRA, Keishi YAMAGUCHI
Effects of machine tool stiffness and cutting path density on infeed face grinding of silicon wafer
Released on J-STAGE: January 12, 2011 | Volume 54 Issue 1 Pages 45-49
Libo ZHOU, Takahito MITSUTA, Jun SHIMIZU, Yebing TIAN, Takeyuki YAMAMOTO
Machining of difficult-to-machine materials by PVD coated tools
Released on J-STAGE: April 22, 2014 | Volume 57 Issue 8 Pages 536-541
Koji SHIMAMURA, Akira HOSOKAWA, Kosuke IBE, Takashi UEDA, Seiichi MASA
Precision laser slicing technology for single crystal SiC wafers
Released on J-STAGE: March 01, 2022 | Volume 65 Issue 10 Pages 549-555
Yohei YAMADA, Tomohiro IKEDA, Satomi KOMATSUZAKI, Junichi IKENO
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