ExLibris header image
SFX Logo
Title: Wire bonded 3D coils render air core microtransformers competitive
Source:

Journal of Micromechanics and Microengineering [0960-1317] Moazenzadeh, A yr:2013


Collapse list of basic services Basic
Full text
Full text available via EZB-NALIM-00482 IOP Archive NL
GO
Document delivery
Request document via Library/Bibliothek GO
Users interested in this article also expressed an interest in the following:
1. Fischer, A C. "Unconventional applications of wire bonding create opportunities for microsystem integration." Journal of micromechanics and microengineering 23.8 (2013): 83001-. Link to Full Text for this item Link to SFX for this item
2. Su, B. "Sensors: Mimosa‐Inspired Design of a Flexible Pressure Sensor with Touch Sensitivity (Small 16/2015." Small 11.16 (2015): 1885-1885. Link to Full Text for this item Link to SFX for this item
3. Vykydal, M. "FITPix — fast interface for Timepix pixel detectors." Journal of instrumentation 6.1 (2011). Link to Full Text for this item Link to SFX for this item
4. Jia, F. "Optimal magnetic susceptibility matching in 3D." Magnetic resonance in medicine 69.4 (2012): 1146-1156. Link to Full Text for this item Link to SFX for this item
5. Anton, G. "A hybrid photodetector using the Timepix semiconductor assembly for photoelectron detection." Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment 602.1 (2009): 205-208. Link to SFX for this item
6. Ryan, H. "Contactless NMR spectroscopy on a chip." Analytical chemistry 84.8 (2012): 3696-3702. Link to Full Text for this item Link to SFX for this item
Select All Clear All

Expand list of advanced services Advanced
A service provided by the Library of the Wissenschaftspark Albert Einstein, Potsdam, Germany.
© 2005 SFX by Ex Libris Inc.