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Title:
Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse
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Journal of Micromechanics and Microengineering [0960-1317] Peter, Daniel yr:2011
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Peter, Daniel
Dalmer, Michael
Lechner, Alfred
Gigler, Alexander M
Stark, Robert W
Bensch, Wolfgang
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Peter, Daniel
Dalmer, Michael
Lechner, Alfred
Gigler, Alexander M
Stark, Robert W
Bensch, Wolfgang
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Peter, Daniel
Dalmer, Michael
Lechner, Alfred
Gigler, Alexander M
Stark, Robert W
Bensch, Wolfgang
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