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Microencapsulated polyaniline particles for electrorheological materials

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Department of Polymer Science and Engineering, Inha University, Inchon, 402-751, South Korea

    H. J. Choi

  2. Department of Polymer Science and Engineering, Inha University, Inchon, 402-751, South Korea

    Y. H. Lee & C. A. Kim

  3. Department of Chemical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213, USA

    M. S. Jhon

Authors
  1. H. J. Choi
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  2. Y. H. Lee
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  3. C. A. Kim
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  4. M. S. Jhon
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Choi, H.J., Lee, Y.H., Kim, C.A. et al. Microencapsulated polyaniline particles for electrorheological materials. Journal of Materials Science Letters 19, 533–535 (2000). https://doi.org/10.1023/A:1006718107735

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