Spinning Effect of Barreling Plating on Physical Properties and Electrochemical Behavior of Copper Layers
Released on J-STAGE: February 10, 2024 |
Article ID 2024-003
Syamsuir, Rizky Septian Kusumah, Agung Premono, Ahmad Lubi, Bambang Soegijono, Sigit Dwi Yudanto, Maman Kartaman Ajiriyanto, Sri Ismarwanti, Rosika Kriswarini, Cahaya Rosyidan, Dwi Nanto, Basori, Ferry Budhi Susetyo
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