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  • 2000-2004  (3)
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  • 1
    Digitale Medien
    Digitale Medien
    Bingley : Emerald
    Microelectronics international 17 (2000), S. 16-20 
    ISSN: 1356-5362
    Quelle: Emerald Fulltext Archive Database 1994-2005
    Thema: Elektrotechnik, Elektronik, Nachrichtentechnik
    Notizen: Plastic ball grid array (PBGA) packages are non-hermetic surface mount packages, designed in response to market demands for cost-effective, high I/O count, small footprint, and low profile components. Because of the materials and construction, PBGA packages can be vulnerable to failure mechanisms associated with exposure to temperature and humidity. In some applications, conformal coating has been used as a potential means to mitigate these problems by enhancing moisture ingress resistance. This study focused on the ability of two popular kinds of conformal coatings to protect PBGA packages from moisture-induced failures. As part of the study, PBGA packages with and without conformal coatings were subjected to moisture ingress, moisture desorption and unbiased high temperature high humidity tests. The principal failure mechanisms observed were delamination and cracking in the packages. Although it was observed that parylene coating did slow down the moisture ingress, the high temperature high humidity tests did not demonstrate that two tested conformal coatings had significant protection against moisture-induced failures for PBGA packages.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
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  • 2
    Digitale Medien
    Digitale Medien
    Bradford : Emerald
    Circuit world 30 (2004), S. 34-40 
    ISSN: 0305-6120
    Quelle: Emerald Fulltext Archive Database 1994-2005
    Thema: Elektrotechnik, Elektronik, Nachrichtentechnik
    Notizen: Eliminating lead in electronics is an environmentally considerate approach that is made prior to manufacture. Recently enacted legislation encourages increased recycling of electrical and electronic products. However, recycling is typically an end-of-use action occurring just before final disposal. From an environmentally-considerate perspective, lead elimination or replacement is a better approach. Short of having a definitive study to follow, industry, regulators, and consumers are proceeding with the change. Various lead-free alloys have been tested and used for electronic components and assemblies. There are many replacements for eutectic tin-lead solder, and alloys containing tin, silver, copper, and bismuth have been used successfully. Assessing how the electronics industry is addressing the change to lead-free materials and processes requires answers to various questions. These questions regard the effects of changes to electronic products and their processes. What drives lead-free migration, how processes can develop, and when products will be available are issues which define the assessment.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
    BibTip Andere fanden auch interessant ...
  • 3
    Digitale Medien
    Digitale Medien
    Bradford : Emerald
    Circuit world 30 (2004), S. 46-51 
    ISSN: 0305-6120
    Quelle: Emerald Fulltext Archive Database 1994-2005
    Thema: Elektrotechnik, Elektronik, Nachrichtentechnik
    Notizen: This paper presents the analysis of information collected from numerous patent searches on lead-free alloys. The significance of claim structure and content is discussed in view of the growing number of lead-free patents. Patent analysis software was developed to effectively compare over 350 lead-free alloy patents. A case study was conducted to assess Sn-Ag-Cu and special purpose lead-free candidate alloy intellectual property. The results show that there are a number of patents and patent applications that may affect the use of "popular" Sn-Ag-Cu formulations.
    Materialart: Digitale Medien
    Standort Signatur Erwartet Verfügbarkeit
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