ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In this paper, mixed slurries containing silica abrasives and polystyrene (PS) polymerparticles in deionized water at pH 10.5 have been evaluated for silicon wafer polishing. By applyingthe theory of electric double layer model, the effect of the particle interactions in mixed slurry isinvestigated. Zeta potential measurements and TEM images have been used to show the formationof composite particles. The polishing mechanism with composite particles slurries is discussed.Polishing experiments with the mixed slurries formed by coating smaller (~30nm) abrasives ontosofter and larger (~2000nm) polymer particles have shown the superior characteristic with higherremoval rate and high surface quality
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/39/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.24-25.155.pdf
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