ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Reliability optimization design of Ball Grid Array (BGA) solder joints is a major concernin area array electronics packaging technology. In this paper, shapes of the solder joints and theirreliability were predicted and analyzed. Through the variations of lower pads’ diameters, the shapesof full array BGA solder joints with different solder volumes were predicted by using surface evolversoftware. Based on the results of shape prediction, 3-D finite element models were established withMSC.MARC and the distribution of the stress and strain in the BGA solder joints under thermalcyclic loading were simulated. Finally, fatigue lives of the BGA solder joints with different soldervolumes were calculated, and the diameter ratios of lower pad to upper pad for these two kinds ofBGA assemblies with the best reliability were optimized
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.353-358.2944.pdf
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