ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Structural model of plastic electronic package under temperature and humidity isconstructed, and the coupling of the thermal and moisture impact on structure field is implemented.The impact of thermal expansion, hygro-swelling and vapor pressure increases with increasing initialdefect, especially the impact of vapor pressure. At certain crack length, KI and KII induced by thermalexpansion is proportional to temperature difference, and KI and KII induced by vapor is proportional tovapor pressure. The impacts of thermal expansion and hygro-swelling on ERR decrease during crackpropagation, but the impact of vapor pressure increases significantly
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.353-358.2940.pdf
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