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  • 1
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Capacitance-voltage (C-V) characteristics of the low-pressure chemical vapor deposited phospho-silicate glass (P-glass) films deposited on thin (∼250 A(ring)) thermal SiO2 films on silicon have been investigated as a function of the phosphorus content and rapid thermal annealing in the temperature range of room temperature to 450 °C carried out in various ambients. Simultaneously, the quantitative hydrogen concentration depth profiles of both as-deposited and annealed oxide films were obtained using the nuclear reaction technique. The C-V characteristics were found to be related to the charges in the oxide. The charge density, in turn, is controlled by both the phosphorus and the hydrogen (hydrogenous species) concentration in the films. An interactive relationship that controls the C-V characteristics is postulated between the presence of phosphorus and hydrogen and their concentrations in these oxides. A schematic model is presented that also postulates that hydrogenous species of two different characters are present in these films: one that easily comes out of the film at low temperature annealing and the other that comes out at significantly higher temperatures.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 4214-4219 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of exposing chemical vapor deposited silicon dioxide directly to water has been investigated. Unlike the effect of the water-related traps in thermally grown silicon dioxide, the capacitance-voltage (C-V) shift due to diffused-in water molecules is directly observed without using the method of avalanche injection. The resonate nuclear reaction technique with 15N ion beam has been used to measure the hydrogen concentration of water-boiled, as-deposited, and rapid thermal-annealed silicon dioxide films. These depth profiles show that the hydrogen-containing species, that are most likely water molecules, diffuse in and out and redistribute in the as-deposited and rapid thermal-annealed films. These hydrogen depth profiles also indicate that the amount of diffused-in water molecules in the oxide is limited by the solubility of the water in the oxide. The solubility of water in the oxide annealed at high temperatures is found to be significantly lower than that in the as-deposited oxide. It is found that diffused-in water molecules, in order to satisfy the water solubility of the oxide, play a compensating role in controlling the oxide charges. Water molecules would continue to diffuse in, and interact with oxide charges and produce charges with reverse polarity that compensate the existing oxide charges until water solubility is satisfied.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 3458-3463 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The occurrence of stress in thin films has led to serious considerations of stability problems in the semiconductor industry. It may cause mechanical failure of films, such as adhesion reduction or contact peel-off, or variations in electrical properties. The existence of stress will also alter electromigration behavior for thin metal lines. The elastic stress in a multilayered structure due to thermal processing is calculated by use of the principle of mechanics balance. It is found that the variation of thickness in one film will not affect the magnitude of stress in another film. The shearing and peeling stress at the edge of a patterned structure, which is responsible for the peeling of a film at the edge, is then modeled and discussed in detail. Finally, the relaxation of stress by viscous motion of SiO2 is analyzed based on Maxwell's viscoelastic model.
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  • 4
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Mobile ions like sodium are known to cause instabilities in metal oxide semiconductor devices. Phosphosilicate glasses (P glasses) have been used as passivating layers to isolate the active devices from such contamination. In this study we have examined the effectiveness of tetraethylorthosilicate plasma-enhanced chemical vapor deposited P glasses, as the barrier to sodium diffusion, as a function of the phosphorus concentration. High-frequency capacitance versus voltage (C-V) measurements, bias-temperature measurements, C-V measurements after etch back, and current versus voltage (I-V) measurements were performed. The results of these C-V and I-V studies on P-glass samples purposely contaminated with sodium and annealed indicate that 2–4 wt % of phosphorus is sufficient to passivate successfully against sodium.
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 4623-4625 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of copper silicide by reaction of silane with sputtered copper films has been observed at temperatures as low as 300 °C. The growth kinetics have been monitored by both sheet resistance and x-ray diffraction techniques. Cu5Si is the first phase to form followed next by Cu3Si, coincident with the loss of the original copper layer. The silicide layer provides significant oxidation protection for the underlying copper up to 550 °C in air.
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 74 (1993), S. 1331-1334 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Ion implantation can be used effectively to passivate copper. The effect of B ion implantation on the oxidization rate of copper is studied as a function of B energy and dose. The increase of sheet resistance associated with ion implantation damage and with the incorporation of B is studied. It is found that a post-implantation inert gas annealing (at 400 °C for 20 min) removes the increase in sheet resistance caused by implant damage while preserving the passivation effects of the B implant.
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 2947-2950 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of exposing low-temperature-annealed chemical vapor deposited phosphosilicate glass films directly to water on the properties of such oxides has been studied. The capacitance-voltage (C-V) curves of these as-deposited oxides have been known to shift on annealing at temperatures in the range of 150–1000 °C in gaseous or vacuum ambients. It is found that when exposed to water, with the increasing duration of water exposure, the C-V curves of these annealed oxides gradually shift back, to the original preanneal location on the voltage axis. The effect, which is similar to the reported effect of water-related traps, is directly observed without using avalanche injection. The C-V recovery is, however, limited to oxides annealed at temperatures ≤450 °C. Hydrogen concentration analysis clearly associates these C-V shifts with changes in concentration resulting from an anneal in a gaseous ambient or to the water exposure. If, however, the oxides are dry annealed at temperatures of 500 °C or higher, the C-V recovery, on water exposure, is very small. So is the increase in the hydrogen concentration, confirming the role of the hydrogenous species in the oxide. The results also suggest a structural change in the oxide occurring at temperatures above 500 °C and leading to oxides that have much lower water solubility compared to that in as-deposited oxides or oxides annealed at temperatures ≤450 °C. Possible mechanisms of oxide charge generation are discussed.
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 1833-1836 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Silicide formation in Pt-Si bilayers was induced by rapid isothermal annealing using incoherent light from tungsten halogen lamps. The growth sequence of the Pt2Si and the PtSi phases that evolved as the result of the solid state reaction in the bilayers was monitored by Rutherford backscattering spectroscopy. The identification of the phases was confirmed by x-ray diffraction. Activation energies for the formation of the Pt2Si and the PtSi phase were determined to be 1.38 and 1.67 eV, respectively. These values agree with the reported results of the formation of these silicides by furnace anneals. Hence, rapid isothermal anneals do not appear to enhance the solid-state reactions in Pt-Si bilayers. It was also found that even rapid thermal anneals led to the formation of a very thin oxide that provided protection to the underlying silicide during selective Pt etch.
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 81 (1997), S. 7261-7267 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Reflection x-ray pole figure analysis techniques were used to study the heteroepitaxial relationships of the cobalt germanide CoGe2 to GaAs(100). The alloy films were grown using the partially ionized beam deposition technique, in which low energy Ge+ ions are employed to alter the heteroepitaxial orientation of the CoGe2 deposits. The CoGe2[001](100)(parallel)GaAs[100](001) orientation, which has the smallest lattice mismatch, was found to occur for depositions performed at a substrate temperature around 280 °C and with ∼1200 eV Ge+ ions. Lowering the substrate temperature or reducing the Ge+ ion energy leads to CoGe2(100) orientation domination with CoGe2[100](010)(parallel)GaAs[100](001) and CoGe2[100](001)(parallel)GaAs[100](001). Substrate temperature alone was seen to produce only the CoGe2(100) orientation. For CoGe2(001) films, additional energy was required from Ge+ ions in the evaporant stream. © 1997 American Institute of Physics.
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 3627-3631 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The properties of thin films of Cu with 1 at. % Al are explored. As-deposited films of Cu(1 at. % Al) oxidize orders of magnitude more slowly than do those of pure Cu. After Cu(1 at. % Al) films are annealed in Ar at 400 °C for 30 min, very thin protective layers of aluminum oxide form on the surface. These thin oxide layers stop further oxidation of the copper. Cu(1 at. % Al) films also adhere better to SiO2 than do films of pure copper. Unlike pure Cu, films of Cu(1 at. % Al) remain microscopically smooth after anneals at temperatures up to 700 °C. In addition, Cu(1 at. % Al) films show no diffusion of Cu (as measured by Rutherford backscattering spectroscopy) into SiO2 at temperatures up to 700 °C. The addition of Al to Cu does increase its resistivity by about 2 μΩ cm per 1 at. % Al, but a possible procedure to avoid this problem is proposed.
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