ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Chemical mechanical polishing has emerged recently as an indispensable processingtechnique in large scale integration. In chemical and mechanical polishing process, chemical andmechanical principle is the vital factor in the removal process. Little is known about what isoccurring beneath a wafer during Chemical Mechanical Polishing (CMP) processes. The paperprovides a LIF technology to visualize the fluid flow between the wafer and pad. In this paper, theexperiment setup is built. And then, the images of fluorescence intensity excited by LIF have beenobtained from CCD. Finally, the relationships between pH, temperature, laser power, film thicknessand fluorescence intensity excited by LIF (Laser induced Fluorescence) are studied
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.315-316.279.pdf
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