ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
This paper discusses the effect of plating condition on the mechanical properties andresidual stress of electroplated Cu film. The inlaid copper structure was fabricated on silicon waferwhere silicon oxide was thermally grown. Seed layer was deposited by sputtering method followed bycopper electro-deposition. Copper was electrodeposited with IBM paddle type electroplating machineResidual stress, hardness, elastic modulus, and surface roughness of electroplated copper film wereinvestigated at various organic additives in plating solution and current types with a nanoindenter anda surface profilometer. The dishing amounts in chemical mechanical polishing (CMP) was alsoinvestigated at various additives. The results show that, in the case of residual stress, the copper filmdeposited at higher additive or PC current result in lower residual stress. The additives do notsignificantly affect the mechanical properties of Cu deposit
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.26-28.637.pdf
Permalink
