ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Adhesion of flexible copper clad laminates (FCCL) on two different types of polyimide(PI), sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI), were studied. Chromium(Cr), strongly reacts with dangling O bonds, was used as tie-coating layer in order to improve lowadhesion between copper (Cu) and polyimide (PI). Polyimide surfaces were pretreated with gasplasma that was generated with a mixture of argon and oxygen before sputtering process. Adhesionmeasurement was performed on these samples according to IPC specification. The results show thatthe peel strength of the FCCL on SRPI was higher than on CRPI. This is considered to be due to theformation of Cu-Cr-O solid solution at the metal- PI interface
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/52/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.321-323.1675.pdf
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