ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Double sided polishing process has become a main machining method for silicon waferfinishing process, but it is difficult to get ultra-smooth surface with the very stringent machiningconditions. In this paper, the mechanism of ultra-smooth surface machining process was studied, themain parameters affecting the surface quality of silicon wafer, such as the polishing pad and carrierrotation speed, polishing press, polishing slurries etc. , were discussed and optimized, thenultra-smooth surface of silicon wafer with Ra 0.4nm has been obtained based on the above study. Anew double sided polishing machine with computer control system equipped with a digitalcontrolled press valve was developed, and the ultra-smooth machining process of silicon wafer wasestablished in this paper
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.472.pdf
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