ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Microstructure and mechanical properties of the 55%, 60% and 67% Mo/Cu compositesfor electronic packaging application fabricated by a patent squeeze casting route have beeninvestigated. The results show that Mo particles are homogeneously distributed in the matrix, and theMo-Cu interfaces are clean, free from interfacial reaction products and amorphous layers. Thedensification of the Mo/Cu composites is higher than 99%. The as-received composites exhibit aBrinell hardness varying from HB178.1 to HB196.9 and an elastic modulus varying from 177GPa to213 GPa. The tensile strength of the composites is higher than 480MPa. Moreover, the compositesdisplay favorable plasticity, while the elongation of the 55% Mo/Cu composite is as high as 5%.Obtaining high tensile strength and elongation in the composite is attributed to the high densification,as well as the clean and smooth Mo-Cu interfaces, both resulting from the cost-effectivesqueeze-casting technology
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.353-358.2883.pdf
Permalink