ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Issues relating to the fabrication of complex multichip modules were investigated from a manufacturability perspective. The use of a preimidized photosensitive polyimide reduces the number of processing steps, thus making it a desirable dielectric material. Factors influencing the polyimide resolution, stress, and feature profile were studied both by experimentation and modeling. Thermal cure cycles for polyimide baking were optimized for solvent resistance, polyimide mechanical properties, and process throughput. Studies were also done on polyimide interactions with metal depositions, including adhesion and polyimide surface damage. Results of this research are shown as embodied in a fabricated 1.4 Gbit/s optical transceiver multichip module.
Additional Material:
14 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760322119
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