ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Oxygen-free high conductivity copper was subjected to room temperature equal channelangular extrusion of 8 passes using route Bc. The resulting ultra-fine grain copper was then rolled tothickness reductions of up to 96.5% at liquid nitrogen temperatures. Annealed coarse grained copperwas rolled to the same strain at room temperature for comparison. Samples from the two routeswere isochronally and isothermally annealed, and the microstructure and texture evolution studiedby electron back scattered diffraction and x-ray diffraction.Annealing of the ultrafine grained copper led to the development of a strong rotated cube texturefrom a texture in the rolled material dominated by the Brass component. In contrast the morecommonly observed cube texture was found after annealing of the coarse-grained sample.Accompanying the rotated cube texture was the development of a large fraction of boundaries withrotation angle/axis close to 60° 〈111〉
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/17/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.558-559.177.pdf
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