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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 3924-3928 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thin Ti films containing Sb were deposited on silicon by electron-beam evaporation. The films were annealed in three steps at different temperatures in order to achieve simultaneous Sb doping and self-aligned TiSi2 formation. Sb behavior during the Ti silicide formation and silicide structures were investigated with Auger electron spectroscopy, transmission electron microscopy, and secondary ion mass spectroscopy. Shallow n+-p junctions have been obtained by using a modified self-aligned TiSi2 process.
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 68 (1990), S. 4535-4541 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: An experimental study has been made on reactions in codeposited and multilayer films consisting of silicon and titanium deposited by electron beam evaporation. Transmission electron microscopy and Auger electron spectroscopy were used to determine structures and compositions. The experimental results from the codeposited films in the whole composition range (0%–100%) were compared with the predictions from the calculated free-energy diagram of the Si-Ti system. It is revealed that the phenomena of metal-induced crystallization of amorphous silicon and formation of amorphous alloys appear in two different composition ranges in the binary system. Metal-induced crystallization of amorphous silicon is attributed to lowering of bonding energy of SiSi bonds by titanium atoms in the Si-rich composition range and the formation of an amorphous Si-Ti alloy is attributed to the dominant SiTi bonding due to the largely negative heat of mixing between the two elements in a medium composition range.
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 68 (1990), S. 4542-4549 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Silicides, amorphous alloys, and metal-induced crystallization of amorphous Si are commonly encountered in solid-state reactions between Si and metals. In order to investigate the possible correlations between these phenomena, a thermodynamic analysis was made on various binary systems consisting of Si and metals. It was revealed that (1) the capability of forming silicides between Si and a transition metal results from the largely negative heat of mixing in a certain medium composition range of the two elements; (2) amorphous Si-metal alloys may form not only in the systems which form silicides, but also in some systems which do not form stable silicides; and (3) the phenomenon of metal-induced crystallization of amorphous Si occurs in a Si-rich composition range of a binary system, which is attributed to the lowering of Si—Si bonding energy, owing to the incorporation of metal species. A model describing the phenomenon is developed.
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 6394-6399 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The crystallization of amorphous Si induced by Al during heat treatment has been investigated by cross section and plan view transmission electron microscopy. The lowest temperature of Al induced crystallization of amorphous Si was found to be 440 K. The crystallization temperature, however, depends on the thickness of Al layers in layered structures and on the concentration of Al in co-deposited layers below 1-nm-layer thickness and 15 at.% of Al concentration, respectively. Al-induced crystallization in layered structures starts at the Al/amorphous Si interfaces and is located close to them. The amount of crystallized Si depends on the quantity of Al and on the temperature and increases with them. The mechanism of crystallization involves intermixing of Al with Si and the formation of an alloy of high metal concentration in the amorphous/crystalline interface. When the formation of this alloy is not assured due to low Al concentration, then crystallization does not start or the process of crystallization stops. In Al induced crystallization the nucleation of polycrystalline Si grains rather than their crystal growth is affected.
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 74 (1993), S. 891-896 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thin amorphous Si1−xBx films, with x0 ranging from 0 to 0.5, were coevaporated onto preoxidized (100) Si wafers and quartz substrates, by using a dual-electron-gun high-vacuum system. In order to study how the structural and optical properties depended on concentration and annealing temperature, heat treatments of the films were carried out at temperatures from 400 up to 1000 °C. The films were characterized by means of transmission electron microscopy, Auger electron spectroscopy, and spectrophotometry. It is shown that: (i) An amorphous Si1−xBx alloy can exist up to very high temperatures (≥1000 °C), when x is larger than ∼0.4; (ii) at 400 °C the optical band gap of an amorphous Si1−xBx alloy has the maximum value (1.59 eV) for x0=0.02 and then decreases to lower values for higher concentrations (e.g., 1.18 eV for x0=0.3); (iii) the measured optical band gap of amorphous Si1−xBx increases gradually with increasing annealing temperature up to 700–900 °C, and then increases rapidly when annealed at a higher temperature by about 0.5 eV. These changes can be associated with microstructural alterations. The stable amorphous Si1−xBx alloy with x0=0.3 has, for instance, a measured band gap of 1.23 and 1.74 eV after annealing at 800 and 900 °C, respectively. The relationship between the microstructure and the band gap of the films is discussed.
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 514-519 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Co-deposited amorphous TiSi2 thin films with various Sb concentrations were prepared in order to study the effects of Sb on TiSi2 phase transformations. The crystallization behavior of the films was investigated by in situ annealing in a transmission electron microscope. The phase transformation from C49 TiSi2 to C54 TiSi2 in the films was examined with x-ray diffraction. It was observed that incorporation of Sb resulted in a higher crystallization temperature of the amorphous TiSi2 film and a lower crystal growth rate. The activation energies for the crystal growth during the crystallization were determined to be 1.37, 1.62, 1.63, and 1.87 eV (±0.07 eV) for the films with 0, 0.3, 1.3, and 2.5 at. % Sb, respectively. For the C49→C54 transformation, it was, however, observed that the activation energy decreased when the Sb content increased. These indicate that the Sb incorporation in TiSi2 retards the crystallization of the amorphous TiSi2 film, but enhances the transformation from C49 TiSi2 to C54 TiSi2.
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 70 (1991), S. 4857-4862 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: B-doped polycrystalline Si films were prepared by electron beam evaporation and heat treatment in order to study the influence of B concentration and annealing temperature on recrystallization of polycrystalline Si. By using cross-sectional transmission electron microscopy and Auger electron spectroscopy it is shown that: (1) at a B concentration between 1 and 10 at. %, post-annealing at 1100 °C results in an enhanced solid phase epitaxial growth; (2) at a B concentration higher than 10 at. %, post-annealing results in a retarded recrystallization of polycrystalline Si; (3) a relatively stable amorphous alloy can form at a B concentration of ∼35 at. % up to 1100 °C. The mechanisms of the enhancement and the retardation are discussed.
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 76 (1994), S. 5179-5184 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thermal stability and crystallization of amorphous Si:P alloy thin films consisting of 20–44 at. % P have been studied in this work. The results show that the alloys have crystallization temperatures ranging from 850 to 1150 °C, which are all higher than that of pure amorphous Si, and that the variation of resistivity of the alloys during the 120 h aging at 300 °C is small (0.6%). These results indicate that the alloys have a high thermal stability, which is in agreement with the thermodynamic prediction we have made. It has also been observed that the crystallization products for these alloys are different. A new silicon phosphide phase has been observed in the 30 at. % alloy sample and suggested to be possibly a hexagonal Si7P3 phase which has lattice parameters a=5.32 A(ring) and c=13.3 A(ring). The alloy films were deposited onto quartz substrates and Si wafers by coevaporation of Si and P. X-ray diffractometry and transmission electron microscopy were utilized to investigate the crystallization temperature and product of the amorphous alloys.
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 77 (1995), S. 301-307 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Measurements are reported on the infrared (IR) absorption, the optical band gap, and the dark conductivity of amorphous silicon-phosphorus alloy thin films (a-Si:P) with 20–44 at. % P prepared by coevaporation of Si and P. The results show that the optical band gap can be tailored in a range of 1.5–2.15 eV by varying the P concentration and the annealing temperature. The band gap for the sample with 20 at % P is the widest (1.70–1.82 eV) when annealed at temperatures ≤600 °C. From the IR-absorption study, a stretching mode associated with Si—P bonds at 465–474 cm−1 has been found for all alloy films. An evolution (shift or sharpening) of the Si—P absorption band with annealing temperature and P concentration have also been observed. Based on the IR-absorption study the change of bonding structures in the alloy films is discussed. Conductivity measurements show that two electron conduction processes mainly exist in the investigated temperature range: extended-state conduction in the conduction band at high temperatures and hopping conduction in the band tail at low temperatures. The transition temperature is around room temperature (14–55 °C), indicating that the carriers may mainly drift by hopping even at room temperature. The correlation between the optical band gap and the bonding structure is discussed. © 1995 American Institute of Physics.
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 53 (1988), S. 902-904 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We have investigated a Sb-enhanced solid phase epitaxy of Si on a p-type (100)Si substrate through intermixing of amorphous Si and Sb thin films and a subsequent recrystallization of the polycrystalline Si (poly-Si). By using cross-sectional transmission electron microscopy, we show that a high concentration of Sb enhances recrystallization of poly-Si, which eventually results in an epitaxial growth of Si. This is most likely due to an enhanced Si self-mobility caused by a Sb diffusion in the vicinity of the grain boundaries of the poly-Si. At the same time the doped layer was observed to serve as a diffusion source for doping the Si substrate. Secondary ion mass spectrometry measurements reveal the concentrations and the depth profiles of Sb in the Si substrate.
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