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  • 1
    Publication Date: 2005-11-30
    Description: Extreme value theory is examined to explain the cause of the bias and spread in performance of communications systems characterized by low bit rates and high data reliability requirements, for cases in which underlying noise is Gaussian or perturbed Gaussian. Experimental verification is presented and procedures that minimize these effects are suggested. Even under these conditions, however, extreme value theory test results are not particularly more significant than bit error rate tests.
    Keywords: COMMUNICATIONS
    Type: JPL Quart. Tech. Rev., Vol. 1, No. 4; p 58-68
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  • 2
    Publication Date: 2011-08-23
    Description: As part of a program to develop high performance/high temperature adhesives and composite matrices for a Mach 2.4 high speed civil transport, imide oligomers containing phenylethynyl groups were investigated. Phenylethynyl groups were placed on the ends of oligomers of different molecular weights (1250, 2500 and 5000 g/mol), pendent along the backbone of oligomers and both pendent and terminal on oligomers. Many different compositions of phenylethynyl containing imide oligomers had been previously prepared and evaluated before selecting the composition based upon 3,3'.4,4'-biphenyltetracarboxcylic dianhydride (BPDA), 3.4'-oxydianiline (3,4'-ODA) and 1,3-bis(3-aminophenoxy)benzene (APB) for extensive work. 4-Phenylethynylphthalic anhydride (PEPA) was used to place phenylethynyl groups on the ends of the oligomers and 3,5-diamino-4'-phenylethynylbenzophenone (DPEB) was used to introduce pendent phenylethynyl groups along the oligomeric backbone. Upon heating above 300 C, the phenylethynyl groups react to provide chain extension, branching and cross linking. Several of these materials exhibited excellent properties as adhesives and composite matrices. The chemistry, processability and properties of the oligomers, the cured polymers, bonded specimens and composites from phenylethynyl containing oligomers are presented.
    Keywords: Composite Materials
    Type: Polymer (ISSN 0032-3861); Volume 41; 5073-5081
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  • 3
    Publication Date: 2011-08-23
    Description: As an extension of work on pendent phenylethynlyl-containing imide oligomer, three new diamines containing pendent phenylethynyl groups were prepared and characterized. These diamines were used to prepare pendent and pendent and terminal phenylethynyl imide oliogomers via the amide acid route in N-methyl-2-pyrrolidinone at a calculated number average molecular weight of 5000 g mol (exp -1). The pendent phenylethynyl groups were randomly distributed along the oliogomer backbone and provided a means of controlling the distance between reactive sites. The imide oligomers were characterized and thermally cured, and the cured polymers evaluated as thin films and compared with materials of similar composition prepared from 3,5-diamino-4'-phenylethynylbenzophenone. This work was performed as part of a continuing research effort to develop structural resins for potential aeronautical applications.
    Keywords: Chemistry and Materials (General)
    Type: High Performance Polymers (ISSN 0954-0083); Volume 12; 213-223
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  • 4
    Publication Date: 2011-08-23
    Description: As part of a program to develop high-performance/high-temperature structural resins for aeronautical applications, imide oligomers containing pendent and terminal phenylethynyl groups were prepared, characterized and the cured resins evaluated as composite matrices. The oligomers were prepared at a calculated number-average molecular weight of 5000 g/mol and contained 15-20 mol% pendent phenylethynyl groups. In previous work, an oligomer containing pendent and terminal phenylethynyl groups exhibited a high glass transition temperature (approximately 313 C), and laminates therefrom exhibited high compressive properties, but processability, fracture toughness, microcrack resistance and damage tolerance were less than desired. In an attempt to improve these deficiencies, modifications in the oligomeric backbone involving the incorporation of 1,3-bis(3-aminophenoxy)benzene were investigated as a means of improving processability and toughness without detracting from the high glass transition temperature and high compressive properties. The amide acid oligomeric solutions were prepared in N-methyl-2-pyrrolidinone and were subsequently processed into imide powder, thin films, adhesive tape and carbon fiber prepreg. Neat resin plaques were fabricated from imide powder by compression moulding. The maximum processing pressure was 1.4 MPa and the cure temperature ranged from 350 to 371 C for 1 h for the mouldings, adhesives, films and composites. The properties of the 1,3-bis(3-aniinophenoxy)benzene modified cured imide oligomers containing pendent and terminal phenylethynyl groups are compared with those of previously prepared oligomers containing pendent and terminal phenylethynyl groups of similar composition and molecular weight.
    Keywords: Nonmetallic Materials
    Type: High Performance Polymers (ISSN 0954-0083); Volume 10; 273-283
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  • 5
    Publication Date: 2016-03-01
    Description: Bandwidth constraints in earth-satellite communication systems force consideration of uncoded M-ary modulation to obtain increased data rates. M-ary phase shift keying (MPSK) at first glance seems most promising because of the high transmitter efficiency achieved through Class C operation. Multiple phase-and-amplitude modulation candidates such as quadrature amplitude shift keying (QASK) appear less promising because the transmitter must operate at lower efficiency (in linear or multimode operation). However, initial studies indicate that QASK offers significant raw dc-power savings over MPSK, despite the reduced transmitter efficiency. For example, at S-band both solid-state and traveling wave tube (TWT) QASK transmitters can provide a 3-dB average dc-power savings over comparable 16-ary phase shift keying (PSK) for the same bit rate and error probability. The reason for this savings is that QASK requires much less average signal-to-noise ratio than 16-ary PSK for the same error rate.
    Keywords: COMMUNICATIONS
    Type: JPL Quart. Tech. Rev.; Vol. 2; No. 4; p 62-71
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  • 6
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    In:  Other Sources
    Publication Date: 2011-08-19
    Description: NASA's Deep Space Network (DSN) consists of a worldwide set of communication stations and a central control facility in California, enabling communication with spacecraft thousands of millions of miles from earth. The stations have gone from 26 m diameter antennas operating at 960 MHz to 70 m diameter (by 1988) at 8400 MHz. The DSN provides exceptional performance in high gain steerable antennas, ultra-low noise receivers, high power transmitters, frequency and time standards, and precise radio metric data. Spacecraft missions envisaged in the 1990's for the continuing exploration of the Solar System include an array of increasingly complex visits to the inner planets, asteroids and comets and the outer planets. The Deep Space Network planned for the mid-1980s may not meet all the needs of these missions without substantial change. Deep space stations may require conversion to operation with beam waveguides, higher frequency and relative frequency stability of 10 to the -16th. A deep space relay station in earth orbit could permit operation at higher frequencies, with attendant higher performance. Long range planning to select the appropriate future network configurations and develop the technologies essential to their implementation is underway.
    Keywords: SPACE COMMUNICATIONS, SPACECRAFT COMMUNICATIONS, COMMAND AND TRACKING
    Type: (ISSN 0007-084X); 38; 458-464
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  • 7
    Publication Date: 2011-08-23
    Description: Organically modified montmorrrillonite clay, containing a long chain aliphatic quarternary ammonium cation, was used to prepare polyimide/organoclay hybrids. Several approaches were examined in an attempt to achieve fully exfoliated nanocomposites. These included simple mixing of the clay in a pre-made high molecular weight poly(amide acid) solution; simple mixing followed by sonication of the organoclay/poly(amide acid) solutions; and the preparation of high molecular weight poly(amide acid)s in the presence of the organoclay dispersed in N-methyl-2-pyrrolidinone (NMP). The best results were obtained using the in-situ polymerization approach. The resulting nanocomposite films (both amide acid and imide), containing 3-8% by weight of organoclay, were characterized by differential scanning calorimetry (DSC), dynamic thermogravimetric analysis (TGA), transmission electron microscopy (TEM), X-ray diffraction (XRD), and thin film tensile properties. A significant degree of dispersion was observed in the nanocomposite films of the amide acid and the imide. After thermal treatment of amide acid films to effect imidization, in both air and nitrogen, the films were visually darker than control films without clay and the level of clay dispersion appeared to have decreased. In the latter case, the separation between the layers of the clay decreased to a spacing less than that present in the original organoclay. These observations suggest that thermal degradation of the aliphatic quarternary ammonium cation occurred likely during thermal treatment to effect imidization and solvent removal. These thermal degradation effects were less pronounced when thermal treatment was performed under nitrogen. The polyimide/organoclay hybrid films exhibited higher room temperature tensile moduli and lower strength and elongation to break than the control films.
    Keywords: Composite Materials
    Type: Polymer (ISSN 0032-3861); Volume 43; 813-822
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  • 8
    Publication Date: 2011-08-23
    Description: Polyimide-silica hybrids composed of an organic precursor containing a novel phenylethynyl imide silane and an inorganic precursor were evaluated as an adhesion-promoting interphase between surface-treated titanium alloy and a phenylethynyl-containing imide adhesive. The phenylethynyl groups present in the organic precursor, either as a pendent or end group, can bond chemically with a phenylethynyl-containing imide adhesive during processing, while the silane groups of the organic precursor would react chemically with the inorganic precursor. In addition, the inorganic precursor is able to react with the titanium alloy to form a stable bond with the metal oxide. Bond strength and durability were evaluated by single lap shear tests at various conditions. Lap shear specimens exhibited predominantly cohesive failure after a 3-d water boil with 92% retention of the initial room temperature strength. Morphology and chemical composition of the hybrid interphase were investigated with scanning electron microscopy, X-ray photoelectron spectroscopy, and Auger electron spectroscopy, which revealed development of a silicon-gradient, hybrid structure between the metal substrate and the adhesive.
    Keywords: Nonmetallic Materials
    Type: International Journal of Adhesion and Adhesives (ISSN 0143-7496); Volume 20; 457-465
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  • 9
    Publication Date: 2018-06-08
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  • 10
    Publication Date: 2018-06-08
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